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A Technique for Brazing Aluminum Nitride Substrates

Published online by Cambridge University Press:  21 February 2011

M. Grant Norton ,
Jacek M. Kajda  and
Brian C. H. Steele
M. Grant Norton
Affiliation:
Department of Materials, Imperial College of Science, Technology and Medicine, London SW72BP, England.
Jacek M. Kajda
Affiliation:
Department of Materials, Imperial College of Science, Technology and Medicine, London SW72BP, England.
Brian C. H. Steele
Affiliation:
Department of Materials, Imperial College of Science, Technology and Medicine, London SW72BP, England.
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Abstract

A technique for brazing aluminum nitride (AIN) using conventional (non-active) brazing alloys has been investigated. The process involves the in-situ decomposition of a metal hydride. This process alters the surface chemistry of the substrate and improves the wettability of the molten braze. The development of high strength bonding between braze and ceramic results. The ceramic-braze interface was studied using scanning electron microscopy (SEM). The nature of the interfacial reactions and the reaction products have been identified using x-ray diffraction (XRD). The progress of the reaction has been followed using differential thermal analysis (DTA).

The experimental results have been correlated with thermodynamic predictions of the reaction process. In addition to joining ceramic to ceramic, braze joints of AIN to a low expansion iron-nickel lead frame alloy were made.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 167: Symposium K – Advanced Electronic Packaging Materials , 1989 , 289
Copyright
Copyright © Materials Research Society 1990

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References

1. Kuramoto, N., Taniguchi, H. and Aso, I., IEEE Trans., Components, Hybrids and Manuf. Technol. CHMT9, 386 (1986)Google Scholar
2. Aldinger, F. and Werdecker, W., IEEE Trans., Components, Hybrids and Manuf. Technol. CHMT7, 399 (1984)Google Scholar
3. Norton, M.G., Steele, B.C.H. and Leach, C.A., Science of Ceramics 14, 545 (1987)Google Scholar
4. Norton, M.G., Steele, B.C.H. and Leach, C.A., Brit. Ceram. Soc. Proc, 41, 69 (1989)Google Scholar
5. Norton, M.G., Ph.D. Thesis, University of London (1989)Google Scholar
6. Cox, C., Hutfless, M., Allison, K. and Hankey, D.L., Intl. J. Hybrid Microelectronics, 10, 8 (1987)Google Scholar
7. Werdecker, W., Proc. 5th. European Hybrid Microelectronics Conf. 472 (1985)Google Scholar
8. Iwase, N., Anzai, K., Shinozaka, K., Hirao, O., Dinh-Thanh, T. and Sugiura, Y., IEEE Trans., Components, Hybrids and Manuf. Technol. CHMT 8, 253 (1985)Google Scholar
9. Kluge-Weiss, P. and Gobrecht, J., Proc. Mat. Res. Soc. Symp. (1984)Google Scholar
10. Nicholas, M.G. and Mortimer, D.A., Mater. Sci. and Tech. 1, 657 (1985)Google Scholar
11. Nicholas, M.G., Brit. Ceram. Trans. J. 85, 144 (1986)Google Scholar
12. Chase, M.W., J. Phys. Chem. Ref. Data 4, 1 (1975); &, 793 (1978)Google Scholar
13. Naidich, Yu., Prog. Surf. Membrane Sci. 14, 353 (1981)Google Scholar
14. Norton, M.G., Hybrid Circuits 20, 18 (1989)Google Scholar
15. Pask, J.A., Amer. Ceram. Soc. Bull. 66, 1587 (1987)Google Scholar
16. Santella, M.L., Adv. Ceram. Mater. 3, 457 (1988)Google Scholar
17. Norton, M.G., Kajda, J.M. and Steele, B.C.H., J. Mater. Res. (submitted for publication)Google Scholar
18. Blocher, J.M., in High Temperature Materials and Technology, edited by Campbell, I.E. and Sherwood, E.M. (John Wiley and Sons Inc., New York, 1967), p.379.Google Scholar