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Texture and Related Phenomena of Copper Electrodeposits

Published online by Cambridge University Press:  15 February 2011

D. N. Lee
D. N. Lee*
Affiliation:
Division of Materials Science and Engineering, and Center for Advanced Materials Research, Seoul National University, Seoul 151-742, Korea, snumfc@dosal. snu.ac.kr
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Abstract

The texture of copper electrodeposits changes from the orientation that places the lowest energy crystal facets parallel to the substrate under a condition of low ion concentration adjacent to the deposit, to the orientation that places the higher energy crystal facets parallel to the substrate as the ion concentration adjacent to the deposit increases. The copper electrodeposits have peculiar surface morphologies and microstructures depending on their textures, which in turn may affect their mechanical properties even when they are obtained in similar electrolysis conditions. The electrodeposits undergo recrystallization, when annealed. The recrystallization texture may be different from the original deposit texture. These phenomena have been discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 427: Symposium K – Advanced Metallization for Future ULSI , 1996 , 167
Copyright
Copyright © Materials Research Society 1996

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References

1. Hwang, K. H., Lee, K. I., Joo, S. K. and Kang, T., J. Korean Assoc. Crystal Growth 1, 79 (1991).Google Scholar
2. Pangarov, N. A., Electrochimica Acta 7, 139 (1962).Google Scholar
3. Lee, D. N. and Chang, Y. W., J. Korean Inst. of Metals 12, 234 (1974).Google Scholar
4. Lee, D. N. and Ye, G. C., Plat. and Surf. Fin. 66 (11), 46 (1981).Google Scholar
5. Ye, G. C. and Lee, D. N., Plat. and Surf. Fin. 66 (4), 60 (1981).Google Scholar
6. Lee, D. N. and Kim, Y. K. in Proc. 2nd Asian Metal Finishing Forum, edited by Kanematsu, H. (Tokyo Japan, 1985), p. 130.Google Scholar
7. Lee, D. N., Kang, S. and Yang, J., Plat. and Surf. Fin. 82 (3), 76 (1995).Google Scholar
8. Kang, S., Yang, J.-S. and Lee, D. N., Plat. and Surf. Fin. 82 (10), 67 (1995).Google Scholar
9. Sundquist, B. E., Acta Met. 12, 67 (1964).Google Scholar
10. Park, J. R. and Lee, D. N., J. Korean Inst. Metals 14, 359 (1979).Google Scholar
11. Lee, D. N., J. Mater. Sci. 24, 4375 (1989).Google Scholar
12. Lee, H. R. and Lee, D. N., in Proc. 4th Asian-Pacific Corrosion Control Conference, edited by Yoshizawa, S. and Nii, K. (Tokyo Japan, 1985), p. 955.Google Scholar
13. Kwon, J. W. and Lee, D. N., unpublished result.Google Scholar
14. Lee, D. N., Scripta Metall. Mater. 32, 1689 (1995).Google Scholar