Hostname: page-component-77c89778f8-rkxrd Total loading time: 0 Render date: 2024-07-18T06:33:14.017Z Has data issue: false hasContentIssue false
  • English
  • Français

Thermal Cycling Degradation of YBa2Cu3O9−x Superconductors

Published online by Cambridge University Press:  28 February 2011

Donald L. Kinser ,
Robert H. Magruder III ,
Ronald A. Quarles  and
J. Dora Schaefer
Donald L. Kinser
Affiliation:
School of Engineering, Vanderbilt University, Nashville, TN 37235
Robert H. Magruder III
Affiliation:
School of Engineering, Vanderbilt University, Nashville, TN 37235
Ronald A. Quarles
Affiliation:
School of Engineering, Vanderbilt University, Nashville, TN 37235
J. Dora Schaefer
Affiliation:
School of Engineering, Vanderbilt University, Nashville, TN 37235
Get access

Abstract

Thermal cycling for four cycles between 294 and 78°K has been observed to shift the superconducting transition temperature from 85 to 28°K. Samples cycled for 12 cycles between 373 and 78°K do not display superconductivity at temperatures down to 37°K. Guinier de Wolff X-ray diffraction observations of these samples reveal no crystallography changes during thermal cycling up to 12 cycles. Scanning electron microscopy studies of polished samples of the thermally cycled material revealed the presence of cracks in individual grains within each sample. The percentage of grains displaying cracks climbs rapidly with thermal cycling. We conclude that the loss of superconducting behavior is a consequence of removal of continuous paths but we are not, at this time, able to rationalize the shift of Tc with thermal cycling. We conclude that the thermal expansion anisotropy produces strains which lead to destructive fractures within the material.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 99: Symposium AA – High-Temperature Superconductors , 1987 , 915
Copyright
Copyright © Materials Research Society 1988

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Gleick, J., The New York Times, May 23, 1987 p. 1.Google Scholar
2. Caplin, David, Nature, 328. 376 (1987).Google Scholar
3. Anon., , Scientific American, 257 32 (1987).Google Scholar
4. Swinbanker, David, Nature 328 750 (1987).Google Scholar
5. Ovshinsky, S. R., Young, R. T., Allred, D. D., Maggio, G. M. and Van der Leeden, G. A., Phys. Rev Lettr. 58 2579 (1987).Google Scholar
6. Chen, J. T., Wenger, L. E., McEwan, C. J. and Logothetis, E. M., Phys. Rev Lettr. 58 1972 (1987).Google Scholar
7. Narayan, J., Skukla, V. N., Lukasiewiez, S. J., Biunna, N., Singh, R., Schreiner, A. F. and Pennycock, S. J., Appl. Phvs. Lett. 51 940 (1987).Google Scholar
8. Huang, C. Y., Dries, L. J., Hor, D. H., Meng, R. L., Chu, C. W. and Frankel, R. B., Nature 328 403 (1987).Google Scholar
9. Cima, M. J. and Rhine, W. E., Advanced Ceramic Materials. 2, 329 (1987).Google Scholar
10. Bhargava, R. N., Herko, S. P. and Osborne, W. N., Phvs. Rev. Lettrs. 59 1468 (1987).Google Scholar
11. O'Bryanand, H. M. Gallagher, P. K., Advanced Ceramic Materials. 2 640 (1987).Google Scholar