Hostname: page-component-77c89778f8-swr86 Total loading time: 0 Render date: 2024-07-19T10:18:27.696Z Has data issue: false hasContentIssue false

Thin-Film Transistors Fabricated With Poly-Si Films Crystallized by Microwave Annealing

Published online by Cambridge University Press:  10 February 2011

YongWoo Choi
Affiliation:
Dept. of Materials Science & Engineering, Korea Advanced Institute of Science and Technology, 373-1 Koosung-dong, Yusung-gu, Taejon, 305-701, KOREA
JeongNo Lee
Affiliation:
Dept. of Materials Science & Engineering, Korea Advanced Institute of Science and Technology, 373-1 Koosung-dong, Yusung-gu, Taejon, 305-701, KOREA
TaeWoong Jang
Affiliation:
Dept. of Materials Science & Engineering, Korea Advanced Institute of Science and Technology, 373-1 Koosung-dong, Yusung-gu, Taejon, 305-701, KOREA
ByungTae Ahn
Affiliation:
Dept. of Materials Science & Engineering, Korea Advanced Institute of Science and Technology, 373-1 Koosung-dong, Yusung-gu, Taejon, 305-701, KOREA
Get access

Abstract

Solid phase crystallization has the advantages of low cost and excellent uniformity but the crystallization temperature is too high to use glass as a substrate. Using microwave annealing, we crystallized a-Si films at 550 °C within 3 h, which is much shorter than the annealing time at 600 °C of furnace annealing. We fabricated TFTs with poly-Si films crystallized by microwave annealing at low temperature and obtained the characteristics slightly better than or at least comparable to the TFTs by furnace annealing in spite of smaller grain size. This may be due to the improvement of surface roughness of poly-Si film. The poly-Si TFTs with PECVD a-Si film showed better characteristics than the TFTs with LPCVD a-Si film because of larger grain size and smoother Si/SiO2 interface.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Morozumi, S., Oguchi, K., Yazawa, S., Kodaira, T., Ohshima, H., and Mano, T., SID International Symposium Digest of Technical Papers (Society for Information Display, Philadelpia, 1983) p156.Google Scholar
2. Hayashi, Y., Hayashi, H., Nogishi, M., and Matsushita, T., International Solid State Circuits Conference Digest of Technical Papers (IEEE, SanFrancisco, 1988) p266 Google Scholar
3. Hatalis, M. K. and Greve, D. W., J. Appl. Phys., 63, 2260 (1988).Google Scholar
4. Lee, S. W. and Joo, S. K., IEEE Electron Device Letter, EDL–17, 160 (1996).Google Scholar
5. Sohn, D. K., Lee, J. N., Kang, S. W., and Ahn, B. T., Jpn. J. Appl. Phys., 35, 1005 (1996).Google Scholar
6. Sohn, D. K., Park, S. C., Kang, S. W., and Ahn, B. T., J. Electrochem. Soc., 144, 3592 (1997).Google Scholar
7. Lee, J. N., Choi, Y. W., Lee, B. J., and Ahn, B. T., J. Appl. Phys., 82, 2918 (1997).Google Scholar
8. Rodder, M. and Antoniadis, D. A., IEEE Electron Device Letter, EDL–6, 570, (1985).Google Scholar
9. Yamada, S., Yokoyama, S., and Koyanagi, M., 1990 IEDM Technical Digest, p859 Google Scholar
10. Proano, R. E. and Ast, D.G., J. Appl. Phys. 66, 2189 (1989)Google Scholar