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Three-DimensionalWafer Process Model for Nanotopography
Published online by Cambridge University Press: 01 February 2011
Abstract
This paper proposes a three-dimensional wafer process model for nanotopography. This model allows us to predict the effect and behavior of nanotopography on the wafer processes especially for the wafer Mechanical/Chemical Lapping (MLP/CLP), wafer Single/Double Side Polishing (SSP/DSP) and device Chemical Mechanical Polishing (CMP).
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- Research Article
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- Copyright © Materials Research Society 2003
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