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Transition Metals in Electrically active Sites after Incoherent Light Annealing of Boron-Doped Czochralski-Grown Silicon

Published online by Cambridge University Press:  26 February 2011

D. Barbier
Affiliation:
Institut National des Sciences Appliquées de Lyon, 20 Avenue Albert Einstein, F69621 Villeurbanne Cedex, France
M. Remram
Affiliation:
Institut National des Sciences Appliquées de Lyon, 20 Avenue Albert Einstein, F69621 Villeurbanne Cedex, France
J. Zhu
Affiliation:
Institut National des Sciences Appliquées de Lyon, 20 Avenue Albert Einstein, F69621 Villeurbanne Cedex, France
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Abstract

Two hole trap levels H(0.45) and H(0.29) with properties close to those of metal-related defect states were found in virgin or implanted CZ silicon substrates submitted to a short duration Rapid Thermal Annealing (RTA) around 1000 °C. These hole trap levels were assigned to the presence of Fe or Cr in interstitial solution after RTA. Control experiments using chromium-diffused samples allowed to verify the quenching mechanism of chromium atoms in electrically active site during the annealing treatment, with a cooling rate-dependent concentration. After a subsequent low temperature annealing, the supersaturated interstitial solution of chromium evolves toward more stable defect configurations.

Type
Research Article
Copyright
Copyright © Materials Research Society 1988

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References

REFERENCES

1.Weber, E.R., Appl. Phys. A, 30,122 (1983).Google Scholar
2.Conzelmann, H., Ġraff, K. and Weber, E.R., Appl. Phys. A, 30, 169175 (1983).Google Scholar
3.Kimmerling, L.C. and Benton, J.L., Physica 116B, 297–300, North Holland (1983).Google Scholar
4.Weber, E.R. in Impurity Diffusion and Gettering in Silicon, edited by Fair, R.B., Pearce, C.W. and Washburn, J. (Mater. Res. Soc. Proc. 36, Pittsburgh, PA 1985) pp. 311.Google Scholar
5.Chantre, A., Kechouane, M. and Bois, D. in Defect in Semiconductors II, edited by Mahayan, S. and Corbett, J.W. (North Holland, New York, 1983), p. 547.Google Scholar
6.Barbier, D., Remram, M.Joly, J.F. and Laugier, A., J. Appl. Phys. 61(1), 156160 (1987).Google Scholar
7.Collins, C.B. and Carlson, R.O., Phys. Rev. 108, 6, 1409 (1957).Google Scholar
8.Pensl, G., Schulz, M. and Stolz, P. in Energy beam-Solid Interactions and transient Thermal Processing of Materials, edited by Biegelsen, D.K., Rozgonyi, G.A. and Shank, C.V. (North Holland, New York, 1984), p. 347.Google Scholar