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Wireless and RF Module Packaging using Low Loss Ceramic and Low Loss Organic Materials

Published online by Cambridge University Press:  01 February 2011

James J. Logothetis ,
Daniel I. Amey  and
Timothy P. Mobley
James J. Logothetis
Affiliation:
Merrimac Industries Inc., West Caldwell, NJ
Daniel I. Amey
Affiliation:
Merrimac Industries Inc., West Caldwell, NJ
Timothy P. Mobley
Affiliation:
DuPont Microcircuit Materials Research, Triangle Park, NC
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Abstract

This presentation describes the basics of Multi-Mix® and Green Tape™ Low Temperature Cofired Ceramic (LTCC) technologies. The design and performance of a 28 GHz mixer package using a GaAs MMIC and the 943 Green Tape™ LTCC system with embedded capacitance technology is described including the tradeoffs, advantages and compatibility of Multi-Mix® and Green Tape™ technologies. A design approach combining the technologies offers the designer new options to meet the ever-increasing demands of high frequency packaging.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 783: Symposium B – Materials, Intergration, and Packaging Issues for High-Frequency Devices , 2003 , B1.4
Copyright
Copyright © Materials Research Society 2004

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References

REFERENCES

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