Hostname: page-component-7479d7b7d-jwnkl Total loading time: 0 Render date: 2024-07-13T04:38:49.075Z Has data issue: false hasContentIssue false
  • English
  • Français

Adhesion Of Copper To Polytetrafluoroethylene Polymer Film With Adhesive Layers

Published online by Cambridge University Press:  15 February 2011

Chin-Jong Chan ,
Chin-An Chang  and
Curtis E. Farrel
Chin-Jong Chan
Affiliation:
IBM Research Division, T.J. Watson Research Center, Yorktown Heights, NY 10598
Chin-An Chang
Affiliation:
IBM Research Division, T.J. Watson Research Center, Yorktown Heights, NY 10598
Curtis E. Farrel
Affiliation:
IBM Research Division, T.J. Watson Research Center, Yorktown Heights, NY 10598
Get access

Abstract

Enhanccd adhesion of Copper to spin-coated polytetrafluoroethylene PTFE.) film is achieved by employing an intermediate adhesive layer consisting of fluorinated ethylenepropylene (FEP) and metallic titanium. The peel strength of Cu on PTFE is low (1–2 g/mm) without the adhesive layer. After incorporating the Ti/FEP adhesive layer, a peel strength as high as 80 g/mm can be achieved. The overall peel strength is found to increase with the adhesive layer thickness. Thermal annealing at high temperatures strongly affects its overall peel strength. Previous XPS study indicated the formation of TiCx at the Ti/FEP and Ti/PTFE interfaces. Rutherford backscattering spectrometry and cross-sectional transmission electron microscopy studies revealed that significant amount of Cu diffused into the FEP layer through the Ti layer when the specimens were heat treated at 375°C for various amount of time. Cu diffusion strongly affects the interfacial properties and hence results in the variation of overall peel strength. The results indicate that the thickness of Ti barrier as well as the heat treatment temperature are important for retaining the high peel strength.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 227: Symposium J – Materials Science of High Temperature Polymers for Microelectronics , 1991 , 363
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Tummala, R.R. and Rymaszewski, E.J., Microelectronic Packaging IIandbook, Van Nostrand Reinhold, New York, (1989).Google Scholar
2. Jensen, R.I. and Lai, J.I I., in Polymers for Electronic Application, edited by Lai, J. I I., (1989, CRC press), P. 33.Google Scholar
3. Traskos, R.T., Smith, W.D. and Lockard, S.C., Proc. NEPCON East '90, 823 (1990).Google Scholar
4. Chang, C.-A., Baglin, J.E.E., Schrott, A.G., and Lin, K.C., Appl. Phys. Lett. 51, 103 (1987).Google Scholar
5. Chang, C.-A., Appl. Phys. Lett. 51, 1236 (1987).Google Scholar
6. Kim, Y.-K., Chang, C.-A., and Schrott, A.G., J. Appl. Phys., 67(1), 251 (1990).Google Scholar
7. Chang, C.-A., Kim, Y.-K. and Schrott, A.G.,.J. Vac. Sci. Technol., A 8, 3304 (1990).Google Scholar