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Ceramics in Microelectronics Packaging: Past, Present and Future
Published online by Cambridge University Press: 21 February 2011
Abstract
A broad review of ceramics in microelectronics for processing, storing, transferring, printing, and displaying information is highlighted. Ceramic packaging is presented with a review of the history, evolution, and state of the art. The recent developments in ceramics resulting in potentially improved thermal and electrical properties by the use of SiC, AIN, and glass±ceramics are discussed. The scientific understanding necessary to support these developments is mentioned.
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- Copyright © Materials Research Society 1989
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