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Effects of Electric Fields on the Bending Behavior of Piezoelectric Composite Laminates

Published online by Cambridge University Press:  15 February 2011

J.Q Cheng ,
T.Y. Zhang ,
M.H. Zhao ,
C.F. Qian ,
S. W. R. Lee  and
P. Tong
J.Q Cheng
Affiliation:
Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China
T.Y. Zhang
Affiliation:
Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China
M.H. Zhao
Affiliation:
Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China
C.F. Qian
Affiliation:
Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China
S. W. R. Lee
Affiliation:
Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China
P. Tong
Affiliation:
Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China
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Abstract

This Paper investigates the bending behavior of piezoelectric laminates under combined mechanical and electrical loading. The laminate has a PZT - 5H ceramic core sandwiched by graphite/epoxy plates. Three-point bending tests and in-situ acoustic emission measurements were conducted on the PZT-5H laminates preloaded by an applied electric field. The results show that the PZT-5H core fractures first and then delaminaton occurs along the tensile stressed interface between the PZT ceremic and the graphite/epoxy layer. Finite element analysis was performed to analyze stresses in the sandwich structure under combined mechanical and electrical loading. Consequently, the bending strength of the PZT core was evaluated from the experiment data. The electric field, either positive or negative, reduces the fracture strength of the pzt core.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 604: Symposium LL – Materials for Smart Systems III , 1999 , 59
Copyright
Copyright © Materials Research Society 2000

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