Hostname: page-component-77c89778f8-rkxrd Total loading time: 0 Render date: 2024-07-19T16:26:49.752Z Has data issue: false hasContentIssue false
  • English
  • Français

Effects of Mechanical Strain on the Electrical Performance of Amorphous Silicon Thin-Film Transistors with a New Gate Dielectric

Published online by Cambridge University Press:  31 January 2011

Katherine Wei Song ,
Lin Han ,
Sigurd Wagner  and
Prashant Mandlik
Katherine Wei Song
Affiliation:
kwsong@princeton.edu, Princeton University, Electrical Engineering, Princeton, New Jersey, United States
Lin Han
Affiliation:
kwsong@princeton.edu, Princeton University, Electrical Engineering, Princeton, New Jersey, United States
Sigurd Wagner
Affiliation:
kwsong@princeton.edu, Princeton University, Electrical Engineering, Princeton, New Jersey, United States
Prashant Mandlik
Affiliation:
kwsong@princeton.edu, Princeton University, Electrical Engineering, Princeton, New Jersey, United States
Get access

Abstract

The stiff SiNx gate dielectric in conventional amorphous silicon thin film transistors (TFTs) limits their flexibility by brittle fracture when in tension. We report the effect on the overall flexibility of TFTs of replacing the brittle SiNx gate dielectric with a new, resilient SiO2-silicone hybrid material, which is deposited by plasma enhanced chemical vapor deposition. Individual TFTs on a 50μm-thick polyimide foil were bent to known radii, and measurement of transfer characteristics were made both during strain and after re-flattening. Compared with conventional TFTs made with SiNx, TFTs made with the new hybrid material demonstrated similar flexibility when strained in compression and significantly increased flexibility when strained in tension. Under bending to compressive strain, all TFTs tested delaminated from the substrate for compressive strains greater than 2%. Conventional a-Si:H/SiNx TFTs have been previously found to delaminate at a similar compressive strain. Under bending to tensile strain, the most flexible TFTs made with the new hybrid material that were tested after re-flattening did not exhibit significant changes in transfer characteristics up to strains of ∼2.5%. Conventional a-Si:H/SiNx TFTs have been found to remain functional for strains of up to 0.5%, a value only one-fifth of that for TFTs made with the new hybrid material.

Keywords

thin filmdielectricplasma-enhanced CVD (PECVD) (deposition)
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1196: Symposium C – Large-Area Processing and Patterning for Optical. Photovoltaic and Electronic Devices-2009 , 2009 , 1196-C02-02
Copyright
Copyright © Materials Research Society 2010

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Comber, P. G. le, Spear, W. E., Ghaith, A., Electronics Lett. 15, 179, (1979).Google Scholar
Suo, Z., Ma, E. Y., Gleskova, H., Wagner, S., Appl. Phys. Lett. 74, 1177, (1999).Google Scholar
3. Gleskova, H., Wagner, S., Soboyejo, W., Suo, Z., J. Appl. Phys. 92, 6224, (2002).Google Scholar
4. Gleskova, H., Wagner, S., Suo, Z., Appl. Phys. Lett. 75, 3011, (1999).Google Scholar
5. Han, L., Mandlik, P., Gartside, J., Wagner, S., Silvernail, J. A., Ma, R., Hack, M., Brown, J. J., J. Electrochem. Soc. 156, H106 (2009).Google Scholar
6. Mandlik, P., Gartside, J., Han, L., Cheng, I., Wagner, S., Silvernail, J. A., Ma, R., Hack, M., Brown, J. J., Appl. Phys. Lett. 92, 103309, (2008).Google Scholar
7. Mandlik, P., Han, L., Wagner, S., Silvernail, J. A., Ma, R., Hack, M., Brown, J. J., Appl. Phys. Lett. 93, 203306, (2008).Google Scholar
8. Han, L., Mandlik, P., Cherenack, K. H., Wagner, S., Appl. Phys. Lett. 94, 162105, (2009).Google Scholar