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Elastic, Transversely Isotropic Film Indented by a Punch; Application to Multilayered Thin Films
Published online by Cambridge University Press: 21 February 2011
Abstract
A model calculates the compliance of elastic contact between a punch and bilayer, the latter consisting of a transversely isotropic film on top of isotropic substrate. Used in data analysis, the model helps estimate the Young’s modulus of amorphous silicon (100±20 GPa) layers within amorphous silicon/aluminum multilayer composites deposited on silicon.
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- Research Article
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- Copyright © Materials Research Society 1995