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Long Time Data Retention and A Mechanism in Ferroelectric-Gate Field Effect Transistors with HfO2 Buffer Layer

Published online by Cambridge University Press:  01 February 2011

Koji Aizawa
Affiliation:
Precision & Intelligence Laboratory, Tokyo Institute of Technology, 4259-R2–19 Nagatsuta, Midori-ku, Yokohama 226–8503, Japan
Yoshihito Kawashima
Affiliation:
Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology, 4259-S2–9 Nagatsuta, Midori-ku, Yokohama 226–8503, Japan
Hiroshi Ishiwara
Affiliation:
Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology, 4259-S2–9 Nagatsuta, Midori-ku, Yokohama 226–8503, Japan
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Abstract

A mechanism of the long-time data retention in the p-channel MFIS FETs with Pt/SBT/HfO2/Si gate structures was proposed. The MFIS FETs used in this study exhibited the drain current on/off ratio of approximately 6×103 even after 30 days had elapsed at room temperature. From the leakage current characteristics of the MFIS diode, the bulk leakage current density lower than 10-12 A/cm2 was presumed for 30-days data retention. On the other hand, we showed that the decrease of on-state drain current in the retention characteristics was explained by the flat-band voltage shift of approximately -0.3V for 30 days toward negative voltage direction. Therefore, it was also found that the trapped charge density as low as 1011 cm-2 was needed for obtaining the data retention of 30 days.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

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References

REFERENCES

1. Wu, W., Fumoto, K., Oishi, Y., Okuyama, M., Hamanaka, Y., Jpn. J. Appl. Phys., 35, 1560 (1996).Google Scholar
2. Han, J. P. and Ma, T. P., Appl. Phys. Lett., 72, 1185 (1998).Google Scholar
3. Lim, M. and Kalkur, T. S., Integrated Ferroelectr., 22, 205 (1998).Google Scholar
4. Shin, D. S., Lee, H. N., Kim, Y. T., Choi, I.H., and Kim, B.H., Jpn.J. Appl. Phys., 37, 4373 (1998).Google Scholar
5. Kijima, T. and Matsunaga, H., Jpn. J. Appl. Phys., 37, 5172 (1998).Google Scholar
6. Park, B. E. and Ishiwara, H., Appl. Phys. Lett., 79, 806 (2001).Google Scholar
7. Park, J.D., Choi, J.H., and Oh, T. S., Jpn. J. Appl. Phys., 41, 5645 (2002).Google Scholar
8. Noda, M., Kodama, K., Kitai, S., Takahashi, M., Kanashima, T., and Okuyama, M., J. Appl. Phys., 93, 4137 (2003).Google Scholar
9. Fujisaki, Y., Ogasawara, S. and Ishiwara, H., Ferroelectrics, 292, 3 (2003).Google Scholar
10. Kim, K. H., Han, J. P., Jung, S.W., and Ma, T. P., IEEE Electron Device Lett., 23, 82 (2002).Google Scholar
11. Sakai, S. and Ilangovan, R., IEEE Electron Device Lett., 25, 369 (2004).Google Scholar
12. Aizawa, K., Park, B. E., Kawashima, Y., Takahashi, K., and Ishiwara, H., Appl. Phys. Lett, 85, 3199 (2004).Google Scholar
13. Park, B. E., Takahashi, K., and Ishiwara, H., Appl. Phys. Lett., 85, 4448 (2004).Google Scholar
14. Scott, J. F., Habbal, F., and Zvirgzds, J. A., J. Chem. Phys., 72, 2760 (1980).Google Scholar
15. Aizawa, K., and Tokumitsu, E., Okamoto, K., and Ishiwara, H., Appl. Phys. Lett., 76, 2609 (2000).Google Scholar
16. Ma, T. P. and Han, J. P., IEEE Electron Device Lett., 23, 386 (2002).Google Scholar
17. Zu, W. J., Ma, T. P., Zafar, S., and Tamagawa, T., IEEE Electron Device Lett., 23, 597 (2002).Google Scholar