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Measurement of Interactions between Abrasive Silica Particles and Copper, Titanium, Tungsten and Tantalum

Published online by Cambridge University Press:  01 February 2011

Ruslan Burtovyy
Affiliation:
rburtov@clemson.edu, Clemson University, School of Materials Science & Engineering, 161 Sirrine Hall Clemson SC 29634, United States
Alex Tregub
Affiliation:
alexander.tregub@intel.com, Intel, GFM (Global Fab Materials), Santa Clara,, CA, 95052, United States
Mansour Moinpour
Affiliation:
mansour.moinpour@intel.com, Intel, GFM (Global Fab Materials), Santa Clara,, CA, 95052, United States
Mark Buehler
Affiliation:
mark.buehler@intel.com, Intel, PTD, Hillsboro, OR, 97124, United States
Igor Luzinov
Affiliation:
luzinov@clemson.edu, Clemson University, School of Materials Science & Engineering, 161 Sirrine Hall, Clemson, SC, 29634, United States
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Abstract

Colloidal probe technique has been widely employed to measure the adhesion between micro- and nanosize objects using atomic force microscopy (AFM). However, majority of studies concerns model systems, which do not incorporate real abrasive particles. The approach applied allows measuring adhesion between real CMP nanoparticles and different surfaces. Thin polymer film with high affinity to the particles was used to anchor the particles to a surface. Hollow glass bead (20-30 μm) representing flat surface was attached to soft AFM cantilever. Application of large hollow bead and the cantilever with small spring constant allows measuring the interactions with high sensitivity. Titanium, tungsten and tantalum metals were sputtered on the bead surface. The effect of different factors such as pH value, concentration and type of a surfactant on adhesion between surfaces of metals and silica slurry has been studied. Character and intensity of interactions at the moment of contact have been evaluated from experimental force-distance curves.

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

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References

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