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Open Air Fabrication Process of Cu Thin Films on Teflon Surface Using Arf Excimer Laser Irradiation

Published online by Cambridge University Press:  15 February 2011

M. Okoshi ,
K. Toyoda  and
M. Murahara
M. Okoshi
Affiliation:
Laser Science Research Group, The Institute of Physical and Chemical Research (Riken), 2-1 Hirosawa, Wako, Saitama 351-01, JAPAN
K. Toyoda
Affiliation:
Laser Science Research Group, The Institute of Physical and Chemical Research (Riken), 2-1 Hirosawa, Wako, Saitama 351-01, JAPAN
M. Murahara
Affiliation:
Faculty of Engineering, Tokai University, 1117 Kitakaname, Hiratsuka, Kanagawa 259-12, JAPAN
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Abstract

Copper thin films were selectively fabricated on a Teflon surface by using an ArF excimer laser and a Cu electroless plating solution in open air. Photo-excited C-F bonds of the surface were effectively defluorinated with hydrogen atoms which were photodissociated from the Cu solution. The dangling bonds of the defluorinated carbon atoms were combined with the oxgen and the copper atoms which were also photodissociated. Thus, C-O-Cu bonds were formed on the surface and functioned as Cu nuclei for an electroless plating. The Cu thin films were successfully deposited in electroless plating solution only on the Cu nuclei.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 397: Symposium B – Advanced laser Processing of Materials-Fundamentals and Applications , 1995 , 655
Copyright
Copyright © Materials Research Society 1996

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References

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