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A Patch-Type Flexible Physiological Monitor on a Non-Woven Material

Published online by Cambridge University Press:  26 February 2011

Wen-Yang Chang ,
Jin-Sheng Chang ,
Chun-Hsun Chu ,
Tzong-Che Ho  and
Yu-Cheng Lin
Wen-Yang Chang
Affiliation:
wenyang@itri.org.tw, National Cheng Kung University, Department of Engineering Science, 1 University Road, Tainan, 701, Taiwan
Jin-Sheng Chang
Affiliation:
wenyang@itri.org.tw, Industrial Technology Research Institute, Microsystems Technology Center, No.31, Gongye 2nd Rd., Annan District, Tainan, 709, Taiwan
Chun-Hsun Chu
Affiliation:
wenyang@itri.org.tw, Industrial Technology Research Institute, Microsystems Technology Center, No.31, Gongye 2nd Rd., Annan District, Tainan, 709, Taiwan
Tzong-Che Ho
Affiliation:
wenyang@itri.org.tw, Industrial Technology Research Institute, Microsystems Technology Center, No.31, Gongye 2nd Rd., Annan District, Tainan, 709, Taiwan
Yu-Cheng Lin
Affiliation:
yuclin@mail.ncku.edu.tw, National Cheng Kung University, Department of Engineering Science, 1 University Road, Tainan, 701, Taiwan
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Abstract

The study reported is about an integrated wireless physiological monitor module of the flexible patch type, used on a non-woven material to package this module by a hot press process. The module can monitor the body temperature and heart rate. Experimental results showed that the specification and accuracy should be 25-40 °C ± 0.5 °C and 50-200 bpm ± 2 bpm. The main advantage of the module is that the postural change can be monitored. At the same time, it has also a good adhesion between substrate and components, without crack of conductor trace line after bending the module repeatedly. Thickness is about 2 mm. The aim of this study is to speed up the physiological technology and to create more efficiency by miniaturization. In addition, the acceptance level of wearing it is increased by the small and ergonomic design.

Keywords

packagingstructuralthin film
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 969: Symposium W – Heterogeneous Integration of Materials for Passive Components and Smart Systems , 2006 , 0969-W02-05-V01-05
Copyright
Copyright © Materials Research Society 2007

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