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Plasma Immersion Ion Implantation for Impurity Gettering in Silicon

Published online by Cambridge University Press:  21 February 2011

H. Wong
Affiliation:
Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA 94720;
X. Y. Qian
Affiliation:
Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA 94720;
D. Carl
Affiliation:
Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA 94720;
N. W. Cheung
Affiliation:
Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA 94720;
M. A. Lieberman
Affiliation:
Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, CA 94720;
I. G. Brown
Affiliation:
Lawrence Berkeley Laboratory, Berkeley, CA 94720.
K. M. Yu
Affiliation:
Lawrence Berkeley Laboratory, Berkeley, CA 94720.
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Abstract

We have utilized plasma immersion ion implantation (PIII) to demonstrate effective gettering of metallic impurities in silicon wafers. Metallic impurities such as Ni, Cu or Au were intentionally diffused into Si as marker impurities. The Ar or Ne atoms were ionized in an electron cyclotron resonance (ECR) plasma chamber. The ions were accelerated by a negative voltage applied to the wafer and implanted into the wafer. The as-implanted saturation dose can be as high as 5×1016cm−2. After an annealing step at 1000°C for 1 hour in a N2 ambient, the retained doses and the amount of gettered impurities were measured with Rutherford backscattering spectrometry (RBS). With a retained Ar dose in 1015cm−2 range after annealing, the gettered Ni, Cu and Au were 3.0×1014cm−2, 3.0×1014cm−2 and 4.4×1013cm−2 respectively.

Type
Research Article
Copyright
Copyright © Materials Research Society 1989

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References

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