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Process Development and Reliability Study Of Gfpdni Finish For Sc Packaging

Published online by Cambridge University Press:  10 February 2011

I. Boguslavsky  and
J. A. Abys
I. Boguslavsky
Affiliation:
Bell Laboratories, Lucent Technologies, 600 Mountain Ave., Murray Hill, NJ 07974
J. A. Abys
Affiliation:
Bell Laboratories, Lucent Technologies, 600 Mountain Ave., Murray Hill, NJ 07974
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Abstract

GFPdNi was tested for Frame-Lid Assemblies (FLAs) utilized in the sealing SC packages. Plating conditions were adjusted to enhance corrosion resistance with concurrent control over hydrogen content and thickness distribution of the deposit. GFPdNi-plated lids exhibit excellent corrosion resistance, most notably when compared standard Au-plated and GFPdNi-plated lids after a heat-treatment used to simulate sealing process (Fig. 1). This is most likely due to PdNi layer being known as a good interdiffusion barrier.

The reliability of lidded packages was tested by standard methods. It has been revealed that the thickness of the PdNi layer affects the yield in thermal cycling and thermal shock experiments. Auger studies implemented for failure analysis showed the correlation between intermetallic diffusion during the sealing process (due to insufficient thickness of PdNi deposit) and the reliability of the solder joint. A successful field evaluation trial has proven the capability of this new plating process.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 445: Electronic Packaging Materials Science IX , 1996 , 107
Copyright
Copyright © Materials Research Society 1997

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