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Resonance Method: An Attractive Way to Evaluate Mechanical Properties of Thin Gold Films

Published online by Cambridge University Press:  10 February 2011

P. Attia
Affiliation:
Institut d'Electronique Fondamentale, URA 022, Université Paris XI, 91405 Orsay Cedex, France. Patrick.attia@ief.u-psud.fr
P. Hesto
Affiliation:
Institut d'Electronique Fondamentale, URA 022, Université Paris XI, 91405 Orsay Cedex, France. Patrick.attia@ief.u-psud.fr
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Abstract

Micromechanical test structures have been developed for evaluating mechanical properties of thin gold films. Using micromachining techniques, gold cantilever beams of different geometry (typically 40 to 100-µm-long, 2-µm-thick and around 1-µm-wide), were fabricated. These cantilevers were resonated by electrical excitation in a scanning electron microscope (SEM) and Young's modulus, Q-factor and fatigue properties were deduced from these experiments. The longest cantilevers showed a slight upward curvature which allowed the internal stress gradient to be evaluating.

Type
Research Article
Copyright
Copyright © Materials Research Society 1998

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References

1 Attia, P., Tremblay, G., Laval, R., Hesto, P., Material Science and Engineering B : Solid State Materials for Advanced Technology, Vol. B51, Nos. 1-3, February 1998, pp. 263266.Google Scholar
2 Chu, W.H., Mehregany, M., IEEE Transactions on Electron Devices, Vol. 40, No. 7, July 1993, pp. 12451250.Google Scholar
3 Boutry, M., Bosseboeuf, A., Coffignal, G., Proc. SPIE-Micromachining and microfabrication, Austin (USA), 1996, pp. 126134.Google Scholar
4 Neugebauer, C.A., J. Appl. Phys., Vol. 31, No 6, June 1960, pp. 10961101.Google Scholar
5 Nix, W. D., Mettallurgical Transaction A, Vol. 20A, November 1989, pp. 22172245.Google Scholar
6 Weihs, T.P., Hong, S., Bravman, J.C., Nix, W.D., J. Mater. Res. 3 (5), Sep/Oct 1988, pp. 931942.Google Scholar
7 Petersen, K.E., Guarnieri, C.R., J. Appl. Phys. 50 (11), November 1979, pp. 67616766.Google Scholar
8 Landau, L., Lifchitz, E., in : MIR (Ed.), Théorie de l'élasticité, pp. 151.Google Scholar
9 Attia, P., Hesto, P., Microelectronics Journal (in press).Google Scholar
10 Nathnson, H.C., Newell, W.E., Wickstrom, R.A., Davis, J.R., IEEE Transactions On Electron Devices, Vol. ED–14, No 3, March 1967, pp. 117133.Google Scholar
11 Kiesewetter, L., Zhang, J.M., Sensors and Actuators A, 35 (1992), pp. 153159.Google Scholar
12 Stemme, G., J. Micromech. Microeng. 1 (1991), pp. 113125.Google Scholar
13 Ogo, I., Miller, S.A., MacDonald, N.C., Proc. Actuator 94, pp. 9195.Google Scholar