Hostname: page-component-78c5997874-4rdpn Total loading time: 0 Render date: 2024-11-19T12:02:57.781Z Has data issue: false hasContentIssue false

Silica/Silicone Nanocomposite Films: A New Concept in Corrosion Protection

Published online by Cambridge University Press:  15 February 2011

Theresa E. Gentle
Affiliation:
Dow Corning Corp., Midland, MI. 48686
Ronald H. Baney
Affiliation:
Dow Corning Corp., Midland, MI. 48686
Get access

Abstract

Thin films of silsesquioxane, (HSiO3/2)n, were applied to aluminum panels and to CMOS microelectronic circuit surfaces by spin or dip coating organic solutions of the silsesquioxane. Nanoporous silica was obtained by oxidation of the silsesquioxane. These nanoporous silica films were then vacuum infiltrated with various viscosities of polydimethylsiloxanes (PDMS) to form hydrophobic nanocomposites. The nanocomposite films were shown to provide superior hermetic protection against salt fog exposure when compared to PDMS and silica films alone.

The composite films were characterized by FTIR and optical microscopy. FTIR spectra showed that the silica served as a skeletal framework holding the hydrophobic PDMS in place and preventing loss of adhesion. This is in contrast to PDMS films alone in which blistering of the film from the substrate can occur, thus, allowing ions and moisture to reach the surface and corrosion to take place.

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Wagner, L.C., Elect. Packag. Corros. Microelectron. Proc., ASM's Conf. Electron. Packag., 275282, Ed. Nicholson, M.E., ASM Metals Park, Ohio (1987).Google Scholar
2. Anderson, J.E., Markovac, V. and Troyk, P.R., Mater. Res. Soc. Proc., 108 (Electron. Packag. Mat. Sci. 3) 219–23 (1988).CrossRefGoogle Scholar
3. Anderson, J.E., Markovac, V. and Troyk, P.R., IEEE Trans. Compon. Hybrids, Manuf. Techol., 11(1), 152–8 (1988).Google Scholar
4. Haluska, L.A., Michael, K.W., Tarhay, L., US Patent No. 4749631.Google Scholar
5. Haluska, L.A., Michael, K.W., Tarhay, L., US Patent No. 4756977.Google Scholar