Hostname: page-component-5c6d5d7d68-xq9c7 Total loading time: 0 Render date: 2024-08-09T19:06:05.123Z Has data issue: false hasContentIssue false
  • English
  • Français

Silicon as a Mechanical Material

Published online by Cambridge University Press:  25 February 2011

Kurt Petersen
Kurt Petersen*
Affiliation:
NovaSensor, 1055 Mission Court, Fremont, CA 94539
Get access

Abstract

Now that single crystal silicon has established itself as the preeminent electronic material, increasing applications are being implemented in which silicon's MECHANICAL properties are more important. This paper reviews some of the history behind this trend, explains how and why silicon can be an economical and effective mechanical material, and describes several of the devices which have been demonstrated in this technology.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 76: Symposium C – Science and Technology of Microfabrication , 1986 , 99
Copyright
Copyright © Materials Research Society 1987

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Kobayashi, T., ”Solid-State Sensors and Their Applications in Consumer Electronics and Home Appliances”, in Proc. of Int. Conf. on Solid-State Sensors and Actuators, p. 8, Philadelphia (1985).Google Scholar
2. Petersen, K.E., ”Silicon as a Mechanical Material”, IEEE Proceedings, 70, 420 (1982).Google Scholar
3. Bassous, E., ”Fabrication of Novel Three-Dimensional Microstructures by the Anisotropic Etching of (100) and (110) Silicon”, IEEE Trans. on Electron Devices, ED-25, 1178 (1978).CrossRefGoogle Scholar
4. Zdeblick, M.J., Barth, P.W., and Angell, J.B., ”Microminiature Fluidic Amplifier”, in Proc. of IEEE Solid-State Sensors Workshop, Hilton Head Island, South Carolina (1986).Google Scholar
5. Roylance, L.M. and Angell, J.B., ”A Batch-Fabricated Silicon Accelerometer”, IEEE Trans. on Electron Devices, ED-26, 1911 (1979).Google Scholar
6. Petersen, K.E., Shartel, A., and Raley, N., ”Micromechanical Accelerometer Integrated with MOS Detection Circuitry”, IEEE Trans. on Electron Devices, ED-29, 23 (1982).Google Scholar
7. Chen, P., Jolly, R., Halac, G., Muller, R.S., and White, R. M., ”A Planar Processed PI-FET Accelerometer”, In Proc. International Electron Devices Meeting, (Washington DC, 1980), p. 848.Google Scholar
8. Petersen, K.E., Brown, J., and Renken, W., ”High-Precision High-Performance Mass Flow Sensor with Integrated Laminar Flow Microchannels”, in Proc. of Int. Conf. on Solid-State Sensors and Actuators, p. 361, Philadelphia (1985).Google Scholar
9. Sheppard, N.F., Day, D.R., Lee, H.L., and Senturia, S.D., ”Microdielectrometry”, Sensors and Actuators, 2, 263 (1982).CrossRefGoogle Scholar
10. Lauks, I., Van der Spiegel, J., Sansen, W., and Steyaert, M., ”Multispecies Integrated Electrochemical Sensor with On-Chip CMOS Circuitry”, in Proc. of Int. Conf. on Solid-State Sensors and Actuators, Philadelphia, p. 122 (1985).Google Scholar
11. Schwager, F.J., Bousse, L.J., Bowman, L., and Meindl, J.D., ”Chemical Multisensors with Selective Encapsulation of Ion-Selective Membranes”, in Proc. of IEEE Solid-State Sensor Workshop, Hilton Head, South Carolina (1986).Google Scholar
12. Howe, R.T. and Muller, R.S., ”Integrated Resonant Microbridge Vapor Sensor”, in Proc. of IEEE International Electron Devices Meeting, San Francisco, p. 213 (1984).Google Scholar
13. Bassous, E., Taub, H.H., and Kuhn, L., ”Ink Jet Printing Nozzle Arrays Etched in Silicon”, Appl. Phys. Let., 31, 135 (1977).Google Scholar
14. Tuckerman, D.B. and Pease, R.F.W., ”High-Performance Heat Sinking for VLSI”, IEEE Electron Device Letters, EDL-2, 126 (1981).Google Scholar
15. Guvenc, M.G., ”A V-Groove Silicon Planar Capillary for Insulin Micro-Infusers”, in IEEE Frontiers of Engineering in Health Care, p. 300 (1982).Google Scholar
16. Petersen, K.E., ”Silicon Torsional Scanning Mirror”, IBM J. Res. and Devel., 24, 631 (1980).CrossRefGoogle Scholar
17. Petersen, K.E., ”Micromechanical Membrane Switches on Silicon”, IBM J. Res. and Devel., 23, 376 (1979).Google Scholar
18. Petersen, K.E. and Guarnieri, C.R., ”Young's Modulus Measurements of Thin Films Using Micromechanics”, J. Appl. Phys. 50, 6761 (1979).Google Scholar
19. Mehregany, M., Allen, M.G., and Senturia, S.D., ”The Use of Micromachined Structures for the Measurement of Mechanical Properties and Adhesion of Thin Films”, in Proc. of IEEE Solid-State Sensors Workshop, Hilton Head Island, South Carolina (1986).Google Scholar