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Ternary Phase Formation in 95Pb-5Sn Flip-Chip Solder Bonds

Published online by Cambridge University Press:  15 February 2011

Alan J. Mockler ,
Peter J. Goodhew  and
Elizabeth A. Logan
Alan J. Mockler
Affiliation:
Dept. of Materials Science & Engineering, University of Liverpool, Liverpool L69 3BX, UK
Peter J. Goodhew
Affiliation:
Dept. of Materials Science & Engineering, University of Liverpool, Liverpool L69 3BX, UK
Elizabeth A. Logan
Affiliation:
GEC-Marconi Materials Technology Ltd., Caswell, Towcester, Northants NNL12 8EQ, UK
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Abstract

The microstructure of 95Pb-5Sn flip-chip solder bonds deposited on Cr/Cu/Au metallisation pads has been studied using both light and electron analysis techniques. The presence of Sn-Cu- Au ternary intermetallic phases was detected within the Pb-rich matrix at significant distances from the originally deposited interface. The distribution of the phases present after the solder has undergone a reflow heat treatment can be interpreted using recent equilibrium ternary diagram data. An investigation was also made into the effects of various non-reflow heat treatments at carefully chosen temperatures, to qualitatively evaluate the extent of solid state diffusion and the resultant phase distribution.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 323: Symposium J – Electronic Packaging Materials Science VII , 1993 , 131
Copyright
Copyright © Materials Research Society 1994

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