Hostname: page-component-5c6d5d7d68-wbk2r Total loading time: 0 Render date: 2024-08-24T07:16:45.077Z Has data issue: false hasContentIssue false
  • English
  • Français

The Thermal Stability of Ti-Al-C Pvd Coatings

Published online by Cambridge University Press:  15 February 2011

O. Knotek ,
F. Löffler  and
L. Wolkers
F. Löffler
Affiliation:
Materials Science Institute, Aachen University of Technology, 52056 Aachen, Germany
L. Wolkers
Affiliation:
Materials Science Institute, Aachen University of Technology, 52056 Aachen, Germany
Get access

Abstract

While (Ti,Al)N coatings are well known and established in wear applications like drilling and milling, the corresponding TiC based metastable system Ti-Al-C is not well examined. This paper investigates the phase stability and the phase transition behaviour of post-deposition heat-treated Ti-Al-C coatings. The samples were annealed in a temperature range from 600–1400 °C in a high vacuum furnace. The influence of deposition parameters like coating compositions via the Ti/Al ratio and the metal/metalloid ratio on the properties were investigated. Another very important parameter in this investigation is the carbon carrier gas. Examined gases were methane, ethane, ethylene and ethine. The changes in microhardness, lattice parameters and particle sizes were analysed with respect to their temperature dependence.

The phase formation depends on the target composition and on the reactive gas. A formation of a metastable (Ti,Al)C phase can be observed. A higher C:H ratio of the reactive gas leads to better incorporation of carbon into the coating. An Al-loss independent of the coating composition begins 1000 °C. The microhardness increases with higher annealing temperature and decreases with higher Al-content.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 343: Symposium H – Polycrystalline Thin Films - Structure, Texture, Properties and Applications , 1994 , 259
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Quinto, D.T., Wolfe, G.J., Jindakl, P.C., Thin Solid Films, 153, 19 (1987).CrossRefGoogle Scholar
[2] Knotek, O., Böhmer, M., Leyendecker, T., J. Vac. Sci. Technol., A4, 2695 (1986).CrossRefGoogle Scholar
[3] Knotek, O., Löffler, F., Wolkers, L.; Proc. o. AMPT Conference 93, Dublin, Aug. 1993, Vol.1, 427.Google Scholar
[4] Knotek, O., Löffler, F., Wolkers, L.; Proc. o. AMPT Conference 93, Dublin, Aug. 1993, Vol.2, 775.Google Scholar
[4] Wendler, B., Jakubowski, K.; Vac, J., Sci. Technol., A6, 93 (1988).Google Scholar
[5] Munz, W.D. Vac, J.. Sci. Technol, A4, 2717, (1989).Google Scholar
[6] Vancouille, E., Celis, J.P., Roos, J. R., Thin Solid Films, 224, 168 (1993).CrossRefGoogle Scholar