Hostname: page-component-7479d7b7d-8zxtt Total loading time: 0 Render date: 2024-07-10T00:14:45.476Z Has data issue: false hasContentIssue false
  • English
  • Français

Energy efficiency enhancements for semiconductors, communications, sensors and software achieved in cool silicon cluster project*

Published online by Cambridge University Press:  05 July 2013

Frank Ellinger ,
Thomas Mikolajick ,
Gerhard Fettweis ,
Dieter Hentschel ,
Sabine Kolodinski ,
Helmut Warnecke ,
Thomas Reppe ,
Christoph Tzschoppe ,
Jan Dohl  and
Corrado Carta
...Show all authors
Frank Ellinger*
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Thomas Mikolajick
Affiliation:
NaMLab, Nöthnitzer Straße 64, 01187 Dresden, Germany
Gerhard Fettweis
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Dieter Hentschel
Affiliation:
Fraunhofer, Technologie-Campus 3, 09126 Chemnitz, Germany; Maria-Reiche-Straße 2, 01109 Dresden
Sabine Kolodinski
Affiliation:
Globalfoundries, Wilschdorfer Landstraße 101, 01109 Dresden, Germany
Helmut Warnecke
Affiliation:
Infineon, Königsbrücker Straße 180, 01099 Dresden, Germany
Thomas Reppe
Affiliation:
Silicon Saxony, Manfred-von-Ardenne-Ring 20, 01099 Dresden, Germany
Christoph Tzschoppe
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Jan Dohl
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Corrado Carta
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
David Fritsche
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Gregor Tretter
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Maciej Wiatr
Affiliation:
Globalfoundries, Wilschdorfer Landstraße 101, 01109 Dresden, Germany
Stefan Detlef Kronholz
Affiliation:
Globalfoundries, Wilschdorfer Landstraße 101, 01109 Dresden, Germany
Ricardo Pablo Mikalo
Affiliation:
Globalfoundries, Wilschdorfer Landstraße 101, 01109 Dresden, Germany
Harald Heinrich
Affiliation:
Infineon, Königsbrücker Straße 180, 01099 Dresden, Germany
Robert Paulo
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Robert Wolf
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Johannes Hübner
Affiliation:
Radioopt, Altmarkt 10, 01067 Dresden, Germany
Johannes Waltsgott
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Klaus Meißner
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Robert Richter
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Oliver Michler
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Markus Bausinger
Affiliation:
Plastic Logic, An der Bartlake 5, 01109 Dresden, Germany
Heiko Mehlich
Affiliation:
Roth&Rau, An der Baumschule 6-8, 09337 Hohenstein-Ernstthal, Germany
Martin Hahmann
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Henning Möller
Affiliation:
nxp, Am Waldschlösschen 1, 01099 Dresden, Germany
Maik Wiemer
Affiliation:
Fraunhofer, Technologie-Campus 3, 09126 Chemnitz, Germany; Maria-Reiche-Straße 2, 01109 Dresden
Hans-Jürgen Holland
Affiliation:
Fraunhofer, Technologie-Campus 3, 09126 Chemnitz, Germany; Maria-Reiche-Straße 2, 01109 Dresden
Roberto Gärtner
Affiliation:
xfab, Grenzstrasse 28, 01109 Dresden, Germany
Stefan Schubert
Affiliation:
Productivity Engineering, Sachsenallee 9, 01723 Kesselsdorf, Germany
Alexander Richter
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Axel Strobel
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Albrecht Fehske
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Sebastian Cech
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Uwe Aßmann
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Andreas Pawlak
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Michael Schröter
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Wolfgang Finger
Affiliation:
Globalfoundries, Wilschdorfer Landstraße 101, 01109 Dresden, Germany
Stefan Schumann
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Sebastian Höppner
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Dennis Walter
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
Holger Eisenreich
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
René Schüffny
Affiliation:
Technische Universität Dresden, Helmholzstrasse 18, 1069 Dresden, Germany
*
ae-mail: Frank.Ellinger@tu-dresden.de
Get access

Abstract

An overview about the German cluster project Cool Silicon aiming at increasing the energy efficiency for semiconductors, communications, sensors and software is presented. Examples for achievements are: 1000 times reduced gate leakage in transistors using high-fc (HKMG) materials compared to conventional poly-gate (SiON) devices at the same technology node; 700 V transistors integrated in standard 0.35 μm CMOS; solar cell efficiencies above 19% at < 200 W/m2 irradiation; 0.99 power factor, 87% efficiency and 0.088 distortion factor for dc supplies; 1 ns synchronization resolution via Ethernet; database accelerators allowing 85% energy savings for servers; adaptive software yielding energy reduction of 73% for e-Commerce applications; processors and corresponding data links with 40% and 70% energy savings, respectively, by adaption of clock frequency and supply voltage in less than 20 ns; clock generator chip with tunable frequency from 83-666 MHz and 0.62-1.6 mW dc power; 90 Gb/s on-chip link over 6 mm and efficiency of 174 fJ/mm; dynamic biasing system doubling efficiency in power amplifiers; 60 GHz BiCMOS frontends with dc power to bandwidth ratio of 0.17 mW/MHz; driver assistance systems reducing energy consumption by 10% in cars

Type
Research Article
Information
The European Physical Journal - Applied Physics , Volume 63 , Issue 1: International Semiconductor Conference Dresden-Grenoble – ISCDG 2012 , July 2013 , 14402
Copyright
© EDP Sciences, 2013

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Footnotes

*

Contribution to the Topical Issue “International Semiconductor Conference Dresden-Grenoble – ISCDG 2012”, Edited by Gérard Ghibaudo, Francis Balestra and Simon Deleonibus.

References

Ellinger, F., Mikolajik, T., Fettweis, G., Hentschel, D., Kolodinski, S., Warnecke, H., Reppe, T., Tzschoppe, C., Dohl, J., Carta, C., Fritsche, D., Wiatr, M., Kron-holz, S.D., Mikalo, R.P., Heinrich, H., Paulo, R., Wolf, R., Hübner, J., Waltsgott, J., Meißner, K., Richter, R., Bausinger, M., Mehlich, H., Hahmann, M., Möller, H., Wiemer, M., Holland, H.-J., Gärtner, R., Schubert, S., Richter, A., Strobel, A., Fehske, A., Cech, S., Aßmann, U., Höppner, S., Walter, D., Eisenreich, H., Schüffny, R, Cool Silicon ICT Energy Efficiency Enhancements, in IEEE International Semiconductor Conference, Dresden, Grenoble, 2012, pp. 1–4Google Scholar
Lange, A., Sohrmann, C., Jancke, R., Haase, J., Cheng, B., Kovac, U., Asenov, A., A General Approach for Multivariate Statistical MOSFET Compact Modeling Preserving Correlations, in ESSCIRC Helsinki, Finland, 2011.Google Scholar
Lange, A., Haase, J., Mau, H.T., Fitting Standard Cell Performance to Generalized Lambda Distributions, in GLSVLSI, Lausanne, Switzerland, 2011 Google Scholar
Baldauf, T., Wei, A., Herrmann, T., Flachowsky, S., Illgen, R., Höntschel, J., Horstmann, M., Klix, W., Stenzel, R., Study of 22/20 nm Tri-Gate Transistors Compartible in a Low-Cost Hybrid FinFET/Planar CMOS Process, in ISDRS, Maryland, USA, 2011Google Scholar
Horstmann, M., Wie, A., Hoentschel, J., Feudel, T., Schneiper, T., Stephan, R., Gerhardt, M., Krugel, S., Raab, M., Advanced SOI CMOS Transistor Technologies for High-Performance Microprocessor Applications, in CICC, San Jose, USA, 2009, pp. 149–152Google Scholar
Schöne, R., Hackenberg, D., On-line Analysis of Hardware Performance Events for Workload Characterization and Processor Frequency Scaling Decisions, in WOSP/SIPEW, Karlsruhe, Germany, 2011, pp. 481–486Google Scholar
Keil, S., et al.,Establishing Continuous Flow Manufacturing in a Wafertest-Environment via Value Stream Design, in ASMC, Saratoga, USA, 2011, pp. 1–7Google Scholar
Papet, P., et al., High efficiency modules based on Heterojunction solar cells, in ICMAT, 2011.
Isheden, C., Fettweis, G., Energy-Efficient Multi-Carrier Link Adaptation with Sum Rate-Dependent Circuit Power, in IEEE Globecom, Miami, USA, 2010.Google Scholar
Fehske, A., Fettweis, G., Malmodin, J., Biczok, G., IEEE Comm. Magazine 49, 55 (2011)CrossRef
Höppner, S., Shao, C., Eisenreich, H., Ellguth, G., Ander, M., Schüffny, R., A Power Management Architecture for Fast Per Core DVFS in Heterogeneous MPSoCs, in ISCS, Santa Barbara, USA, 2012, pp. 261–264Google Scholar
Höppner, S., Henker, S., Eisenreich, H., Schüffny, R., International Conference on Mixed Design Integr. Circuits Syst., Gliwice, Poland, 2011, pp. 264–269
Walter, D., Höppner, S., Eisenreich, H., Ellguth, G., Henker, S., Hänzsche, S., Schüffny, R., Winter, M., Fettweis, G., A Source-Synchronous 90 Gb/s Capacitively Driven Serial On-Chip Link Over 6 mm in 65 nm CMOS, in ISSCC, San Francisco, USA, 2012Google Scholar
Schroter, M., Chakravorty, A., Compact Hierarchical Modeling of Bipolar Transistors With HICUM (World Scientific Singapore, 2010), ISBN 978-981-4273-21-3CrossRefGoogle Scholar
Pawlak, A., Schröter, M., Krause, J., Céli, D., Derrier, N., HICUM/2 v2.3 parameter extraction for advanced SiGe-heterojunction bipolar transistors, in IEEE Bipolar/BiCMOS Circuits and Technology Meeting, Atlanta, USA, 2011, pp. 195–198Google Scholar
Fritsche, D., Wolf, R., Ellinger, F., IEEE Trans. Microwave Theor. Tech. 60, 3223 (2012)CrossRef
Paulo, R., Drechsel, T., Wolf, R., Carta, C., Ellinger, F., High Efficient Doherty Power Amplifier for Wireless Communication, in IEEE Int. Multi-Conf. on System Signals & Devices, Chemnitz, Germany, 2012 Google Scholar
Wolf, R., Ellinger, F., Eickhoff, R., On the Maximum Efficiency of Power Amplifiers in OFDM Broadcast Systems with Envelope Following, in Int. Conf. on Mobile Lightweight Wireless Systems, Barcelona, Spain, 2010 Google Scholar
Haßler, F., Ellinger, F., Carls, J., Analysis of buck-converters for efficiency enhancements in power amplifiers for wireless communication, in IEEE IMOC, Salvador de Bahia, Brazil, 2007, pp. 616–620Google Scholar
Götz, S., Wilke, C., Cech, S., Aßmann, U., Architecture and Mechanisms for Energy Auto Tuning, Sustainable Green Computing (IGI Global, 2011)
Siligaris, A., Richard, O., Martineau, B., Mounet, C., Chaix, F., Ferragut, R., Dehos, C., Lanteri, J., Dussopt, L., Yamamoto, S.D., Pilard, R., Busson, P., Cathelin, A., Belot, D., Vincent, P., A 65 nm CMOS fully integrated transceiver module for 60 GHz wireless HD applications, in IEEE International Solid-State Circuits Conference, San Francisco, USA, 2011, pp. 162–164Google Scholar
Wiemer, M., Braeuer, J., Wuensch, D., Gessner, T., ECS Trans. 33, 307 (2010)CrossRef
Schuricht, P., Michler, O., Baeker, B., Efficiency-Increasing Driver Assistance at Signalized Intersections Using Predictive Traffic State Estimation, in ITSC, 2011, Portland, USA, pp. 347–352Google Scholar