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Study of structural changes and properties of some Sn-Ag lead-free solder alloys

Published online by Cambridge University Press:  31 October 2007

M. Kamal  and
El Said Gouda
M. Kamal
Affiliation:
Metal Physics Lab., Faculty of Science, Mansoura University, Mansoura, Egypt
El Said Gouda*
Affiliation:
Department of Solid State Physics, Metallurgy Lab., Physics Division, National Research Center, Dokki, Giza, Egypt
*
gouda.el73@yahoo.com
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Abstract

Structure, wetting, mechanical and electrical transport properties of tin- (2.5, 3.5, 5 and 10) wt.% silver alloys have been investigated. The results showed that, addition of silver to pure tin causes more precipitations of the intermetallic compound Ag3Sn. A new intermetallic compound Ag4Sn has been formed with adding Ag more than 3.5 wt.%. This compound causes continuous increase in the Young's modulus and electrical resistivity. While for the wetting measurements, additions of silver to pure tin up to 5 wt.% reduces the contact angle. Above that, the contact angle increases due to more precipitations of Ag–Sn compounds, which may tend to reduce the adhesive forces between molten alloys and the substrate.

Keywords

Type
Research Article
Information
The European Physical Journal - Applied Physics , Volume 40 , Issue 2 , November 2007 , pp. 203 - 205
Copyright
© EDP Sciences, 2007

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