Hostname: page-component-cd9895bd7-fscjk Total loading time: 0 Render date: 2024-12-13T11:07:44.022Z Has data issue: false hasContentIssue false
  • English
  • Français

Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding

Published online by Cambridge University Press:  15 May 2017

Yi Zhong ,
Ning Zhao ,
Wei Dong ,
Haitao Ma ,
Mingliang Huang ,
Luqiao Yin  and
Chingping Wong
Yi Zhong
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
Ning Zhao*
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
Wei Dong
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
Haitao Ma*
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
Mingliang Huang
Affiliation:
School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
Luqiao Yin
Affiliation:
Key Laboratory of Advanced Display and System Applications (Shanghai University), Ministry of Education, Shanghai 200072, China
Chingping Wong
Affiliation:
School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta 30332, Georgia, USA
*
a) Address all correspondence to these authors. e-mail: zhaoning@dlut.edu.cn
b) e-mail: htma@dlut.edu.cn
Get access

Abstract

By reflowing Cu/Sn/Ni ultrafine interconnects under a temperature gradient, a new transient liquid phase (TLP) bonding process was proposed for three-dimensional packaging applications. The evolution of the dominant (Cu,Ni)6Sn5 intermetallic compounds depends strongly on the temperature gradient. The essential cause of such dependence is attributed to the different amounts of Cu and Ni atomic fluxes being introduced into the liquid solder. Under the coupling effect of thermomigration and Cu–Ni cross-interaction, the total atomic flux of Cu and Ni is promoted. As a result, the growth of dense (Cu,Ni)6Sn5 is significantly accelerated and the formation of Cu3Sn is eliminated. The new TLP bonding process consumes only a limited amount of the Ni substrate, but much more from the Cu substrate. The mechanism for the new TLP bonding process is discussed and experimentally verified in this study.

Keywords

bondingelectronic materialpackaging
Type
Articles
Information
Journal of Materials Research , Volume 32 , Issue 16 , 28 August 2017 , pp. 3128 - 3136
Check for updates
Copyright
Copyright © Materials Research Society 2017 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Footnotes

Contributing Editor: C. Robert Kao

References

REFERENCES

Munding, A., Hübner, H., Kaiser, A., Penka, S., Benkart, P., and Kohn, E.: Cu/Sn solid-liquid interdiffusion bonding. In Wafer Level 3-D ICs Process Technology, Tang, C.S., Gutmann, R.J., and Reif, L.R. eds. (Springer, New York, USA, 2008); pp. 131–169.Google Scholar
Humpston, G. and Jacobson, D.M.: Principles of Soldering (ASM International, Materials Park, USA, 2004).Google Scholar
Cook, G.O. and Sorensen, C.D.: Overview of transient liquid phase and partial transient liquid phase bonding. J. Mater. Sci. 46, 5305–5323 (2011).Google Scholar
Bosco, N.S. and Zok, F.W.: Critical interlayer thickness for transient liquid phase bonding in the Cu–Sn system. Acta Mater. 52, 2965–2972 (2004).Google Scholar
Li, J.F., Agyakwa, P.A., and Johnson, C.M.: Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process. Acta Mater. 58, 3429–3443 (2010).Google Scholar
Quitoriano, N., Wong, W.S., Tsakalakos, L., Cho, Y., and Sands, T.: Kinetics of the Pd/In thin-film bilayer reaction: Implications for transient-liquid-phase wafer bonding. J. Electron. Mater. 30, 1471–1475 (2001).Google Scholar
Studnitzky, T. and Schmid-Fetzer, R.: Phase formation and diffusion soldering in Pt/In, Pd/In, and Zr/Sn thin-film systems. J. Electron. Mater. 32, 70–80 (2003).Google Scholar
Yoon, S.W., Glover, M.D., and Shiozaki, K.: Nickel-tin transient liquid phase bonding toward high-temperature operational power electronics in electrified vehicles. IEEE Trans. Power Electron. 28, 2448–2456 (2013).Google Scholar
Li, J.F., Agyakwa, P.A., and Johnson, C.M.: Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process. Acta Mater. 59, 1198–1211 (2011).Google Scholar
Huang, M.L., Wu, C.M.L., Lai, J.K.L., and Chan, Y.C.: Microstructural evolution of alead-free solder alloy Sn–Bi–Ag–Cu prepared by mechanical alloying during thermal shock and aging. J. Electron. Mater. 29, 1021–1026 (2000).Google Scholar
Ho, C.E., Yang, S.C., and Kao, C.R.: Interfacial reaction issues for lead-free electronic solders. J. Mater. Sci.: Mater. Electron. 18, 155–174 (2007).Google Scholar
Wang, S.J. and Liu, C.Y.: Kinetic analysis of the interfacial reactions in Ni/Sn/Cu sandwich structures. J. Electron. Mater. 35, 1955–1960 (2006).Google Scholar
Huang, Y.S., Hsiao, H.Y., Chen, C., and Tu, K.N.: The effect of a concentration gradient on interfacial reactions in microbumps of Ni/SnAg/Cu during liquid-state soldering. Scr. Mater. 66, 741–744 (2012).Google Scholar
Hsiao, H.Y., Liu, C.M., Lin, H.W., Liu, T.C., Lu, C.L., Huang, Y.S., Chen, C., and Tu, K.N.: Unidirectional growth of microbumps on (111)-oriented and nanotwinned copper. Science 336, 1007–1010 (2012).Google Scholar
Chen, C., Hsiao, H.Y., Chang, Y.W., Ouyang, F.Y., and Tu, K.N.: Thermomigration in solder joints. Mater. Sci. Eng., R 73, 85–100 (2012).Google Scholar
Yang, Y.S., Yang, C.J., and Ouyang, F.Y.: Interfacial reaction of Ni3Sn4 intermetallic compound in Ni/SnAg solder/Ni system under thermomigration. J. Alloys Compd. 674, 331–340 (2016).Google Scholar
Guo, M.Y., Lin, C.K., Chen, C., and Tu, K.N.: Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints. Intermetallics 29, 155–158 (2012).Google Scholar
Zhao, N., Zhong, Y., Huang, M.L., Ma, H.T., and Dong, W.: Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu joints under temperature gradient. Sci. Rep. 5, 13491 (2015).Google Scholar
Zhong, Y., Huang, M.L., Ma, H.T., Dong, W., Wang, Y.P., and Zhao, N.: In situ study on Cu–Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient. J. Mater. Res. 31, 609–617 (2016).Google Scholar
Zhao, N., Zhong, Y., Huang, M.L., Ma, H.T., and Dong, W.: Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient. Intermetallics 79, 28–34 (2016).Google Scholar
Incropera, F.P. and DeWitt, D.P.: Fundamentals of Heat and Mass Transfer (Wiley, New York, USA, 2001).Google Scholar
Peralta-Martinez, M.V. and Wakeham, W.A.: Thermal conductivity of liquid tin and indium. Int. J. Thermophys. 22, 395–403 (2001).Google Scholar
Tsai, J.Y., Hu, Y.C., Tsai, C.M., and Kao, C.R.: A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni. J. Electron. Mater. 32, 1203–1208 (2003).Google Scholar
Dybkov, V.I.: Growth Kinetics of Chemical Compound Layers (Cambridge International Science Publishing, Cambridge, U.K., 1998).Google Scholar
Nogita, K., Mu, D., McDonald, S.D., Read, J., and Wu, Y.Q.: Effect of Ni on phase stability and thermal expansion of Cu6−x Ni x Sn5 (X = 0, 0.5, 1, 1.5 and 2). Intermetallics 26, 78–85 (2012).Google Scholar
Mu, D., Read, J., Yang, Y., and Nogita, K.: Thermal expansion of Cu6Sn5 and (Cu,Ni)6Sn5 . J. Mater. Res. 26, 2660–2664 (2011).Google Scholar