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Applications of Scanned Probe Microscopy in the Integrated Circuit Fabrication Industry

Published online by Cambridge University Press:  02 July 2020

J. F. Richards
Affiliation:
Materials Technology, Intel Corporation, Santa Clara, CA95052
R.J. Kline
Affiliation:
Materials Technology, Intel Corporation, Santa Clara, CA95052 Department of Materials Science and Engineering, North Carolina State University, Raleigh, NC27695
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Scanning Probe Microscopy (SPM), in particular Atomic Force Microscopy (AFM), has become well establish member of the IC metrology tool arsenal which few IC manufacturers are without. Although Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM) remain the “workhorse” metrology techniques, SPM (standard AFM, as well as Scanning Capacitance Microscopy (SCM), Scanning Spreading Resistance Microscopy (SSRM), Scanning Kelvin probe, Nanoindentaion and others) are being increasingly called upon to help solve IC production problems and to aid in research and development for next generation devices.

Topographical metrology with standard AFM is by far the most common application of SPM in the semiconductor industry. It is typically used to gain surface roughness and grain size information about thin films that can be used as feedback to modify deposition conditions until the desired film properties are obtained.

Type
Scanned Probe Microscopy: Much More Than Just Beautiful Images
Copyright
Copyright © Microscopy Society of America

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References

REFERENCES

1.Feeenstra, R.M. and Griffith, J.E., Characterization and Metrology for ULSI Technology; AIP Conference Proceedings 449, D.G. Seilier ed., (1996) 295307.Google Scholar
2.Diebold, A.C., et. al., J. Vac. Sci. Technol. B 14 (1), (1996) 196CrossRefGoogle Scholar
3.McMurray, J.S., et.al., J. Vac. Sci. Technol. B 15 (4), (1997) 1011CrossRefGoogle Scholar
4.De Wolf, P., et. al., J. Vac. Sci Technol. B 16(1), (1998) 355361CrossRefGoogle Scholar