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2 - Microwave interconnections, probing, and fixturing

from Part I - General concepts

Published online by Cambridge University Press:  05 June 2013

Leonard Hayden
Affiliation:
Teledyne LeCroy
Valeria Teppati
Affiliation:
Swiss Federal University (ETH), Zürich
Andrea Ferrero
Affiliation:
Politecnico di Torino
Mohamed Sayed
Affiliation:
Microwave and Millimeter Wave Solutions, Santa Rosa
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Summary

Introduction

In this chapter concepts related to connecting test equipment to a device-under-test are explored. Application-specific definitions of device boundaries and measures for signal path and power-ground performance are introduced. Practical measurement system accuracy implications of fixture losses are examined, with the surprising result that sometimes more fixture loss can be beneficial to measurement precision. An introduction to the basic elements of microwave probing and probing applications concludes the discussion.

Device boundaries and measurement reference planes

It is necessary to clearly define the boundary of the target of a measurement (known generally as the Device Under Test, or DUT), to distinguish it from the test system – fixture, probes, or other interconnections. The DUT can take many forms. It could be a functional block in a housing with connectors or waveguides for the inputs and outputs. Or a circuit DUT could be an embeddable semiconductor functional design element with a standard interface point such as a microstripline or other transmission lines. At the other extreme, the DUT could be a circuit component such as a transistor, inductor, capacitor, or resistor with no interface elements other than the constituent electrical contacts. Somewhere in between is the fully distributed circuit element. In all cases, the measurement reference planes define the boundaries of the DUT; see Figure 2.1.

For the purposes of discussion let us broadly and perhaps arbitrarily assign DUTs into three categories: Devices, Transmission Lines, and Circuits.

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Publisher: Cambridge University Press
Print publication year: 2013

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References

[1] R. L., Eisenhart, “A Better Microstrip Connector,” Microwave Symposium Digest, 1978 IEEE-MTT-S International, pp. 318–320, 27–29 June 1978.Google Scholar
[2] E., Holzman, Essentials of RF and Microwave Grounding. Norwood, MA: Artech House, 2006.Google Scholar
[3] Philip C., Magnusson, et al., Transmission Lines and Wave Propagation, 4th ed., Boca Raton, FL: CRC Press, 2001.Google Scholar
[4] Agilent Technologies application note 5989–1941 [Online]. Available: www.agilent.com.
[5] Eric, Strid, “A History of Microwave Wafer Probing,” ARFTG Conference Digest-Fall, 50th, vol. 32, pp. 27–34, Dec. 1997.Google Scholar
[6] L., Hayden, “An enhanced Line-Reflect-Reflect-Match calibration,” ARFTG Conference, 2006 67th, pp. 143–149, 16 June 2006.Google Scholar
[7] WinCalTM Calibration Software [Online]. Available: www.cascademicrotech.com.
[8] ProbePointTM Adapter Substrates [Online]. Available: www.jmicrotechnology.com.
[9] M. C. A. M., Koolen, et al., “An improved de-embedding technique for on-wafer high-frequency characterization,” Bipolar Circuits and Technology Meeting, 1991, Proceedings of the 1991, pp. 188–191, 9–10 Sep. 1991.Google Scholar

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