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X-ray Diffraction of Thin Oxide Films on Soldered Module Pins

Published online by Cambridge University Press:  06 March 2019

T. Paul Adi  and
H. F. Stehmeyer
T. Paul Adi
Affiliation:
General Technology Division IBM Corporation Manassas, Virginia
H. F. Stehmeyer
Affiliation:
General Technology Division IBM Corporation Manassas, Virginia
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Abstract

The presence of metal oxide films from wave solder baths on timed module pins are partly responsible for non-wet problems in subsequent soldering steps. The cylindrical geometry of the pins lends itself to the characterization of thin oxide films by using the highly sensitive Debye-Scherrer camera method. As confirmed by Electron Hicroprobe Analysis (EMA), pins containing thin oxide films were used to obtain the diffraction patterns. A software program was developed that subtracts the diffraction angles of an oxids-free control pin from the pattern of the contaminated pin, and tabulates the residual d-spacing (interplanar distance) of the contaminant film.

Type
VI. Analysis of Thin Films by XRD and XRF
Information
Advances in X-Ray Analysis , Volume 32: Thirty-Seventh Annual Conference on Applications of X-ray Analysis, August 1-5, 1988 , 1988 , pp. 303 - 310
Copyright
Copyright © International Centre for Diffraction Data 1988

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References

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