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Effects of vibration on passive intermodulation of microwave connector

Published online by Cambridge University Press:  27 June 2019

Tuanjie Li Open the ORCID record for Tuanjie Li [Opens in a new window] ,
Mingtai Li ,
Wangmin Zhai  and
Jie Jiang
Tuanjie Li
Affiliation:
School of Mechano-Electronic Engineering, Xidian University, Xi'an 710071, China
Mingtai Li
Affiliation:
School of Mechano-Electronic Engineering, Xidian University, Xi'an 710071, China
Wangmin Zhai
Affiliation:
School of Mechano-Electronic Engineering, Xidian University, Xi'an 710071, China
Jie Jiang
Affiliation:
Honghe University, Mengzi, 661100China
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Abstract

This paper investigates the generation of passive intermodulation (PIM) in coaxial connectors during vibration. A series of experiments were designed and the simulation model and method were proposed for understanding these phenomena. We found that PIM is mainly influenced by the contact stress and contact surface roughness during vibration. Thus, a power spectral density method is presented to identify the roughness parameter of contact surface based on the Weierstrass–Mandelbrot model, and the simulation model and method were verified by the relative experiments. Eventually, some suggestions for engineering application were provided.

Keywords

Microwave connectornonlinear contactpassive intermodulation (PIM)surface roughnessvibration
Type
Research Papers
Information
International Journal of Microwave and Wireless Technologies , Volume 12 , Issue 1 , February 2020 , pp. 39 - 47
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2019 

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