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Grain Growth, Stress, and Impurities in Electroplated Copper

Published online by Cambridge University Press:  31 January 2011

S. H. Brongersma ,
E. Kerr ,
I. Vervoort ,
A. Saerens  and
K. Maex
S. H. Brongersma
Affiliation:
IMEC, Kapeldreef 75, B-3001 Leuven, Belgium
E. Kerr
Affiliation:
IMEC, Kapeldreef 75, B-3001 Leuven, Belgium, andScience of Materials, Trinity College, Dublin, Ireland
I. Vervoort
Affiliation:
IMEC, Kapeldreef 75, B-3001 Leuven, Belgium
A. Saerens
Affiliation:
Department of Metallurgy and Materials Engineering, K.U.-Leuven, B-3001 Leuven, Belgium
K. Maex
Affiliation:
IMEC, Kapeldreef 75, B-3001 Leuven, Belgium, andElectrical Engineering Department, K.U.-Leuven, B-3001 Leuven, Belgium
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Abstract

The widely observed secondary grain growth in electroplated Copper layers is shown to be incomplete after the sheet resistance and stress of the layer appear to have stabilized. Instead the layer is in an intermediate state with a grain size distribution that depends on the plating conditions. Further extensive annealing at high temperatures results in an additional considerable enlargement of the grain structure, accompanied by an additional decrease of the sheet resistance and desorption of impurities that were incorporated during plating.

Type
Articles
Information
Journal of Materials Research , Volume 17 , Issue 3 , March 2002 , pp. 582 - 589
Copyright
Copyright © Materials Research Society 2002

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