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Improving tensile and fatigue properties of Sn–58Bi/Cu solder joints through alloying substrate

Published online by Cambridge University Press:  31 January 2011

QingKe Zhang ,
HeFei Zou  and
Zhe-Feng Zhang
Zhe-Feng Zhang*
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People's Republic of China
*
a)Address all correspondence to this author. e-mail: zhfzhang@imr.ac.cn
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Abstract

To eliminate the Bi segregation and interfacial embrittlement of the SnBi/Cu joints, we deliberately added some Ag or Zn elements into the Cu substrate. Then, the reliability of the SnBi/Cu–X (X = Ag or Zn) solder joints was evaluated by investigating their interfacial reactions, tensile property, and fatigue life compared with those of the SnBi/Cu and SnAg/Cu joints. The experimental results demonstrate that even after aging for a long time, the addition of the Ag or Zn elements into the Cu substrate can effectively eliminate the interfacial Bi embrittlement of the SnBi/Cu–X joints under tensile or fatigue loadings. Compared with the conventional SnAg/Cu joints, the SnBi/Cu–X joints exhibit higher adhesive strength and comparable fatigue resistance. Finally, the fatigue and fracture mechanisms of the SnBi/Cu–X solder joints were discussed qualitatively. The current findings may pave the new way for the Sn–Bi solder widely used in the electronic interconnection in the future.

Keywords

SolderingMicroelectronics
Type
Articles
Information
Journal of Materials Research , Volume 25 , Issue 2 , February 2010 , pp. 303 - 314
Copyright
Copyright © Materials Research Society 2010

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