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Manufacturing strategies for wafer-scale two-dimensional transition metal dichalcogenide heterolayers

Published online by Cambridge University Press:  05 February 2020

Mengjing Wang
Affiliation:
NanoScience Technology Center, University of Central Florida, Orlando, Florida 32826, USA
Hao Li
Affiliation:
NanoScience Technology Center, University of Central Florida, Orlando, Florida 32826, USA; and Department of Materials Science and Engineering, University of Central Florida, Orlando, Florida 32826, USA
Tae-Jun Ko
Affiliation:
NanoScience Technology Center, University of Central Florida, Orlando, Florida 32826, USA
Mashiyat Sumaiya Shawkat
Affiliation:
NanoScience Technology Center, University of Central Florida, Orlando, Florida 32826, USA; and Department of Electrical and Computer Engineering, University of Central Florida, Orlando, Florida 32816, USA
Emmanuel Okogbue
Affiliation:
NanoScience Technology Center, University of Central Florida, Orlando, Florida 32826, USA; and Department of Electrical and Computer Engineering, University of Central Florida, Orlando, Florida 32816, USA
Changhyeon Yoo
Affiliation:
NanoScience Technology Center, University of Central Florida, Orlando, Florida 32826, USA
Sang Sub Han
Affiliation:
NanoScience Technology Center, University of Central Florida, Orlando, Florida 32826, USA; and Department of Materials Science and Engineering, Seoul National University, Seoul 08826, South Korea
Md Ashraful Islam
Affiliation:
NanoScience Technology Center, University of Central Florida, Orlando, Florida 32826, USA; and Department of Electrical and Computer Engineering, University of Central Florida, Orlando, Florida 32816, USA
Kyu Hwan Oh
Affiliation:
Department of Materials Science and Engineering, Seoul National University, Seoul 08826, South Korea
Yeonwoong Jung*
Affiliation:
NanoScience Technology Center, University of Central Florida, Orlando, Florida 32826, USA; Department of Materials Science and Engineering, University of Central Florida, Orlando, Florida 32826, USA; and Department of Electrical and Computer Engineering, University of Central Florida, Orlando, Florida 32816, USA
*
a)Address all correspondence to this author. e-mail: yeonwoong.jung@ucf.edu
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Abstract

Modern electronics have been geared toward exploring novel electronic materials that can encompass a broad set of unusual functionalities absent in conventional platforms. In this regard, two-dimensional (2D) transition metal dichalcogenide (TMD) semiconductors are highly promising, owing to their large mechanical resilience coupled with superior transport properties and van der Waals (vdW) attraction-enabled relaxed assembly. Moreover, 2D TMD heterolayers based on chemically distinct constituent layers exhibit even more intriguing properties beyond their mono-component counterparts, which can materialize only when they are manufactured on a technologically practical wafer-scale. This mini-review provides a comprehensive overview of recent progress in exploring wafer-scale 2D TMD heterolayers of various kinds. It extensively surveys a variety of manufacturing strategies and discusses their scientific working principles, resulting 2D TMD heterolayers, their material properties, and device applications. Moreover, it offers extended discussion on remaining challenges and future outlooks toward further improving the material quality of 2D TMD heterolayers in both material and manufacturing aspects.

Type
Invited Feature Paper - Review
Copyright
Copyright © Materials Research Society 2020

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Footnotes

This paper has been selected as an Invited Feature Paper.

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