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Microstructure and diffusion in Nb/NbSn2 metal bonding structure

Published online by Cambridge University Press:  03 March 2011

D.J. Werder ,
C.H. Chen ,
H.S. Chen  and
D.D. Bacon
D.J. Werder
Affiliation:
AT&T Bell Laboratories, Murray Hill, New Jersey 07974-0636
C.H. Chen
Affiliation:
AT&T Bell Laboratories, Murray Hill, New Jersey 07974-0636
H.S. Chen
Affiliation:
AT&T Bell Laboratories, Murray Hill, New Jersey 07974-0636
D.D. Bacon
Affiliation:
AT&T Bell Laboratories, Murray Hill, New Jersey 07974-0636
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Abstract

This communication reports on the microstructure and interdiffusion observed in a new NbSn2/Nb metallization structure on SiO2, previously reported [H. S. Chen et al., Appl. Phys. Lett. 66, 2191 (1995)]. The as-deposited NbSn2 layer was found to be amorphous. After heating, the NbSn2 becomes polycrystalline and heavily diffused with Au from the Au-Sn solder. The Nb layer remains pure and intact after heating. The microstructure, compositions, and phases of the Au-Sn solder layer are also presented.

Type
Rapid Communication
Information
Journal of Materials Research , Volume 10 , Issue 12 , December 1995 , pp. 2988 - 2991
Copyright
Copyright © Materials Research Society 1995

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References

REFERENCES

1Chen, H.S., Bacon, D.D., Chen, C.H., Kammlott, G., Jeng, G.K., Werder, D.J., and Tai, K.L., Appl. Phys. Lett. 66, 2191 (1995).CrossRefGoogle Scholar
2Di, L.M., Bakker, H., Barczy, P., and Gacsi, Z., Acta Metall. Mater. 41, 2923 (1993).CrossRefGoogle Scholar
3Vucht, J.H.N. van, Ooijen, D.J. van, and Bruning, H.A.C.M., Philips Res. Rep. 20, 136 (1965).Google Scholar
4Schubert, K., Anantharaman, T.A., Ata, H.O.K., Meissner, H.G., Dotzschke, M., Rossteutscher, W., and Stols, E., Naturwissenschaften 47, 512 (1960).CrossRefGoogle Scholar
5Reuth, E. C. van and Waterstrat, R.M., Acta Crystallogr. 24B, 186 (1968).CrossRefGoogle Scholar
6Reed, T.B. and Gatos, H.C., J. Appl. Phys. 33, 2657 (1962).CrossRefGoogle Scholar
7Villars, P. and Calvert, L.D., Pearson–s Handbook of Crystallo-graphic Data, 2nd ed. (ASM INTERNATIONAL, Materials Park, OH, 1991), Vol. 1.Google Scholar
8Osada, K., Yamaguchi, S., and Hirabayashi, M., Trans. Japan Inst. Metals 15, 256 (1974).CrossRefGoogle Scholar
9TAPP version 2.0 (1991), software for the personal computer, ES Microware, Inc., Hamilton, Ohio.Google Scholar