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Multilayer thin and ultrathin film capacitors fabricated by chemical solution deposition

Published online by Cambridge University Press:  31 January 2011

Geoff L. Brennecka*
Affiliation:
Sandia National Laboratories, Albuquerque, New Mexico 87185
Chad M. Parish
Affiliation:
Sandia National Laboratories, Albuquerque, New Mexico 87185
Bruce A. Tuttle
Affiliation:
Sandia National Laboratories, Albuquerque, New Mexico 87185
Luke N. Brewer
Affiliation:
Sandia National Laboratories, Albuquerque, New Mexico 87185
*
a)Address all correspondence to this author. e-mail: glbrenn@sandia.gov
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Abstract

Chemical solution deposition has been used to fabricate continuous ultrathin lead lanthanum zirconate titanate (PLZT) films as thin as 20 nm. Further, multilayer capacitor structures with as many as 10 dielectric layers have been fabricated from these ultrathin PLZT films by alternating spin-coated dielectric layers with sputtered platinum electrodes. Integrating a photolithographically defined wet etch step to the fabrication process enabled the production of functional multilayer stacks with capacitance values exceeding 600 nF. Such ultrathin multilayer capacitors offer tremendous advantages for further miniaturization of integrated passive components.

Type
Articles
Copyright
Copyright © Materials Research Society 2008

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References

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