Hostname: page-component-cd9895bd7-jn8rn Total loading time: 0 Render date: 2024-12-28T16:54:34.788Z Has data issue: false hasContentIssue false
  • English
  • Français

Preparation of TiNi films by diffusion technology and the study of the formation sequence of the intermetallics in Ti–Ni systems

Published online by Cambridge University Press:  24 September 2014

Xi Shao ,
Xianglong Guo ,
Yuanfei Han ,
Zhengjie Lin ,
Jining Qin ,
Weijie Lu  and
Di Zhang
Xi Shao
Affiliation:
State Key Laboratory of Metal Matrix Composites, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China
Xianglong Guo*
Affiliation:
State Key Laboratory of Metal Matrix Composites, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China
Yuanfei Han
Affiliation:
State Key Laboratory of Metal Matrix Composites, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China
Zhengjie Lin
Affiliation:
State Key Laboratory of Metal Matrix Composites, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China
Jining Qin
Affiliation:
State Key Laboratory of Metal Matrix Composites, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China
Weijie Lu
Affiliation:
State Key Laboratory of Metal Matrix Composites, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China
Di Zhang
Affiliation:
State Key Laboratory of Metal Matrix Composites, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China
*
a)Address all correspondence to this author. e-mail: guoxiaglong@sjtu.edu.cn
Get access

Abstract

This study presented a novel fabrication process for TiNi thin films by vacuum diffusion technology using reactive Ni/Ti/Ni multilayer thin films. The sandwiched thin films were prepared by chemical nickel plating. Ni/Ti/Ni multilayer films were heat treated for various diffusion times and temperatures and the influences of the temperature and diffusion time on the interdiffusion behavior of the Ti–Ni system were researched in detail. The results showed that a homogeneous TiNi thin film was obtained at 1173 K with a diffusion time of 4 h. Moreover, the formation sequence of the intermetallics in the Ti–Ni diffusion system was investigated by thermodynamic analysis and experiment. It was found that three compounds – TiNi3, Ti2Ni, and TiNi – formed in the diffusion process at the Ti/Ni interfaces. More importantly, the nucleation of TiNi3 and Ti2Ni was prior to that of TiNi because of the lower reaction Gibbs free energy and increasing interface energy of TiNi3 and Ti2Ni.

Keywords

alloydiffusionthin films
Type
Articles
Information
Journal of Materials Research , Volume 29 , Issue 22 , 28 November 2014 , pp. 2707 - 2716
Copyright
Copyright © Materials Research Society 2014 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Simões, S., Viana, F., Ramos, A.S., Vieira, M.T., and Vieira, M.: Reaction zone formed during diffusion bonding of TiNi to Ti6Al4V using Ni/Ti nanolayers. J. Mater. Sci. 48(21), 7718 (2013).Google Scholar
Patel, M., Moon, K.S., Kassegne, S.K., and Morsi, K.: Effects of current intensity and cumulative exposure time on the localized current-activated sintering of titanium nickelides. J. Mater. Sci. 46(20), 6690 (2011).Google Scholar
Fu, Y., Huang, W., Du, H., Huang, X., Tan, J., and Gao, X.: Characterization of TiNi shape-memory alloy thin films for MEMS applications. Surf. Coat. Technol. 145(1), 107 (2001).Google Scholar
Wilson, S.A., Jourdain, R.P., Zhang, Q., Dorey, R.A., Bowen, C.R., Willander, M., Wahab, Q.U., Willander, M., Al-hilli, S.M., and Nur, O.: New materials for micro-scale sensors and actuators: An engineering review. Mater. Sci. Eng., R 56(1), 1 (2007).CrossRefGoogle Scholar
Fu, Y., Du, H., Huang, W., Zhang, S., and Hu, M.: TiNi-based thin films in MEMS applications: A review. Sens. Actuators, A 112(2), 395–408 (2004).Google Scholar
Ishida, A. and Martynov, V.: Sputter-deposited shape-memory alloy thin films: Properties and applications. MRS Bull. 27(02), 111–114 (2002).Google Scholar
de Miranda, R.L., Zamponi, C., and Quandt, E.: Fabrication of TiNi thin film stents. Smart Mater. Struct. 18(10), 104010 (2009).Google Scholar
Lin, Z., Wang, L., Xue, X., Lu, W., Qin, J., and Zhang, D.: Microstructure evolution and mechanical properties of a Ti–35Nb–3Zr–2Ta biomedical alloy processed by equal channel angular pressing (ECAP). Mater. Sci. Eng., C 33(8), 4551 (2013).Google Scholar
Kim, S-W., Jeon, Y.M., Park, C.H., Kim, J.H., Kim, D-H., and Yeom, J-T.: Martensitic phase transformation of TiNi thin films fabricated by co-sputtering deposition. J. Alloys Compd. 580, 5 (2013).Google Scholar
Sekiguchi, Y., Funami, K., and Funakubo, H.: Deposition of NiTi shape memory alloy thin film by vacuum evaporation. In Proceedings of 32nd Meeting of Japan Society of Materials, Japan, 1983; pp. 65–67.Google Scholar
Makino, E., Uenoyama, M., and Shibata, T.: Flash evaporation of TiNi shape memory thin film for microactuators. Sens. Actuators, A 71(3), 187 (1998).CrossRefGoogle Scholar
Makino, E., Mitsuya, T., and Shibata, T.: Fabrication of TiNi shape memory micropump. Sens. Actuators, A 88(3), 256 (2001).Google Scholar
Makino, E., Shibata, T., and Kato, K.: Dynamic thermo-mechanical properties of evaporated TiNi shape memory thin film. Sens. Actuators, A 78(2), 163 (1999).Google Scholar
Lehnert, T., Tixier, S., Böni, P., and Gotthardt, R.: A new fabrication process for Ni–Ti shape memory thin films. Mater. Sci. Eng., A 273–275(0), 713 (1999).Google Scholar
Ho, K.K. and Carman, G.P.: Sputter deposition of NiTi thin film shape memory alloy using a heated target. Thin Solid Films 370(1–2), 18 (2000).Google Scholar
Surbled, P., Clerc, C., Le Pioufle, B., Ataka, M., and Fujita, H.: Effect of the composition and thermal annealing on the transformation temperatures of sputtered TiNi shape memory alloy thin films. Thin Solid Films 401(1), 52 (2001).Google Scholar
Johnson, A.D.: Vacuum-deposited TiNi shape memory film: Characterization and applications in microdevices. J. Micromech. Microeng. 1(1), 34 (1991).Google Scholar
Pan, G., Cao, Z., Wei, M., Xu, L., Shi, J., and Meng, X.: Superelasticity of TiNi thin films induced by cyclic nanoindentation deformation at nanoscale. Mater. Sci. Eng., A 600, 8 (2014).Google Scholar
Chen, X., Lu, Y., Ren, Z., and Zhu, S.: Fabrication of TiNi shape memory alloy thin films by pulsed-laser deposition. J. Mater. Res. 17(02), 279 (2002).Google Scholar
Massalski, P.R.S.H.O.T.B. and Kacprzak, L.: Alloy Phase Diagrams of the ASM Handbook, 9th ed. (ASM International Press, Detroit, MI, 1992); p. 1240.Google Scholar
Bastin, G. and Rieck, G.: Diffusion in the titanium-nickel system: I. Occurrence and growth of the various intermetallic compounds. Metall. Trans. 5(8), 1817 (1974).CrossRefGoogle Scholar
Bastin, G. and Rieck, G.: Diffusion in the titanium-nickel system: II. Calculations of chemical and intrinsic diffusion coefficients. Metall. Trans. 5(8), 1827 (1974).Google Scholar
Garay, J., Anselmi-Tamburini, U., and Munir, Z.A.: Enhanced growth of intermetallic phases in the Ni–Ti system by current effects. Acta Mater. 51(15), 4487 (2003).Google Scholar
Nizhenko, V.I.: Free surface energy as a criterion for the sequence of intermetallic layer formation in reaction couples. Powder Metall. Met. Ceram. 43(5–6), 273 (2004).Google Scholar
Benedictus, R., Böttger, A., and Mittemeijer, E.: Thermodynamic model for solid-state amorphization in binary systems at interfaces and grain boundaries. Phys. Rev. B 54(13), 9109 (1996).Google Scholar
Liu, H., Wang, H., Zhu, W., Tao, X., and Jin, Z.: Prediction of formation of intermetallic compounds in diffusion couples. J. Mater. Res. 22(6), 1502 (2007).CrossRefGoogle Scholar
Wei, S-H. and Lin, C-C.: Phase transformation and microstructural development of zirconia/stainless steel bonded with a Ti/Ni/Ti interlayer for the potential application in solid oxide fuel cells. J. Mater. Res. 29(08), 923 (2014).CrossRefGoogle Scholar
Li, Y., Cui, L., Shi, P., and Yang, D.: Phase transformation behaviors of prestrained TiNi shape memory alloy fibers under the constraint of a hard substrate. Mater. Lett. 49(3), 224 (2001).Google Scholar
De Boer, F., Boom, R., Mattens, W., Miedema, A., and Niessen, A.: Cohesion in Metals. Transition Metal Alloys: Cohesion and Structure (North-Holland, Amsterdam, 1989); Chap. 2.Google Scholar
Miedema, A., De Chatel, P., and De Boer, F.: Cohesion in alloys—fundamentals of a semi-empirical model. Physica B + C 100(1), 1 (1980).Google Scholar
Miedema, A.: On the heat of formation of solid alloys. II. J. Less-Common Met. 46(1), 67 (1976).CrossRefGoogle Scholar
Liu, J., Su, Y., Xu, Y., Luo, L., Guo, J., and Fu, H.: First phase selection in solid Ti/Al diffusion couple. Rare Met. Mater. Eng. 40(5), 753 (2011).Google Scholar
Barin, I., Sauert, F., Schultze-Rhonhof, E., and Sheng, W.S.: Thermochemical Data of Pure Substances, 3rd ed.; VCH Verlagsgesellschaft mbH: Weinheim, Federal Republic of Germany, 1995; pp. 68, 70–71.Google Scholar
Spaepen, F. and Meyer, R.B.: The surface tension in a structural model for the solid-liquid interface. Scr. Metall. 10(3), 257 (1976).Google Scholar
Ewing, R.: The free energy of the crystal-melt interface from the radial distribution function—further calculations. Philos. Mag. 25(4), 779 (1972).Google Scholar
Gosele, U. and Tu, K.: Growth kinetics of planar binary diffusion couples: ‘Thin‐film case’ versus ‘bulk cases’. J. Appl. Phys. 53(4), 3252 (1982).Google Scholar
Hinotani, S. and Ohmori, Y.: The microstructure of diffusion-bonded Ti/Ni interface. Trans. Japan Inst. Met. 29, 116 (1988).Google Scholar
Zhou, Y., Wang, Q., Sun, D., and Han, X.: Co-effect of heat and direct current on growth of intermetallic layers at the interface of Ti–Ni diffusion couples. J. Alloys Compd. 509(4), 1201 (2011).CrossRefGoogle Scholar
Taylor, A. and Floyd, R.: Precision measurements of lattice parameters of non-cubic crystals. Acta Crystallogr. 3(4), 285 (1950).Google Scholar
Yurko, G., Barton, J., and Parr, J.G.: The crystal structure of Ti2Ni. Acta Crystallogr. 12(11), 909 (1959).Google Scholar
Otsuka, K. and Ren, X.: Recent developments in the research of shape memory alloys. Intermetallics 7(5), 511 (1999).Google Scholar
Fukuda, T., Kakeshita, T., Houjoh, H., Shiraishi, S., and Saburi, T.: Electronic structure and stability of intermetallic compounds in the Ti–Ni system. Mater. Sci. Eng., A 273, 166–169 (1999).Google Scholar
Bahmanpour, H., Sun, Y., Hu, T., Zhang, D., Wongsa-Ngam, J., Langdon, T.G., and Lavernia, E.J.: Microstructural evolution of cryomilled Ti/Al mixture during high-pressure torsion. J. Mater. Res. 29(04), 578 (2014).Google Scholar