Hostname: page-component-78c5997874-ndw9j Total loading time: 0 Render date: 2024-11-18T01:12:30.373Z Has data issue: false hasContentIssue false
  • English
  • Français

Reinforced solder joint performance by incorporation of ZrO2 nanoparticles in electroless Ni–P composite layer

Published online by Cambridge University Press:  17 November 2014

Xiao Hu Open the ORCID record for Xiao Hu [Opens in a new window]  and
Y.C. Chan
Xiao Hu*
Affiliation:
Department of Electronic Engineering, City University of Hong Kong, Kowloon Tong, Hong Kong999077
Y.C. Chan
Affiliation:
Department of Electronic Engineering, City University of Hong Kong, Kowloon Tong, Hong Kong999077
*
a)Address all correspondence to this author. e-mail: huxiaokennth@163.com
Get access

Abstract

To reinforce the reliability issue brought by excessive interfacial reaction with the dimensional scale-down of electronic device, an electroless Ni–P–ZrO2 (17.5 at.% of P) composite coating was developed as the under bump metallization (UBM) for lead-free solder interconnect. ZrO2 nanoparticles were proved to be homogeneously distributed and helped improve wetting ability of the layer. Both Sn–3.5Ag/Ni–P–ZrO2 and Sn–3.5Ag/Ni–P solder joints were prepared and aged at various conditions to study the interfacial reaction. Growth of intermetallic compounds (IMCs) without serious spalling in solder/Ni–P–ZrO2 joint was slowed down because of the barrier property of incorporation of ZrO2 nanoparticles, which blocked the diffusion of Ni and Cu atoms. Based on the IMC growth, the activation energy of solder/Ni–P–ZrO2 was estimated to be higher than that of plain solder joint. The top-view of IMCs demonstrated a much finer grain size compared with that of solder/Ni–P joint. A reactive diffusion-induced compound formation mechanism was proposed to address the microstructural evolution in detail. Moreover, solder/Ni–P–ZrO2 joint demonstrated higher shear strength than did solder/Ni–P joint for different aging durations. The fracture surface of solder/Ni–P joint after shear test showed ductile transition failure, with big dimples and plastic deformation.

Keywords

barrier layermicrostructuresoldering
Type
Articles
Information
Journal of Materials Research , Volume 29 , Issue 22 , 28 November 2014 , pp. 2657 - 2666
Copyright
Copyright © Materials Research Society 2014 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Tu, K.N. and Zeng, K.: Tin–lead (SnPb) solder reaction in flip chip technology. Mater. Sci. Eng., R 34, 1 (2001).Google Scholar
Huang, M.L., Ye, S., and Zhao, N.: Current-induced interfacial reactions in Ni/Sn–3Ag–0.5Cu/Au/Pd(P)/Ni–P flip chip interconnect. J. Mater. Res. 26, 3009 (2011).Google Scholar
Jang, D.M. and Yu, J.: Tungsten alloying of the Ni(P) films and the reliability of Sn–3.5Ag/NiWP solder joints. J. Mater. Res. 26, 889 (2011).Google Scholar
Liu, P.L. and Shang, J.K.: Fracture of SnBi/Ni(P) interfaces. J. Mater. Res. 20, 818 (2005).Google Scholar
Jang, J.W., Kim, P.G., Tu, K.N., Frear, D.R., and Thompson, P.: Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology. J. Appl. Phys. 85, 8456 (1999).Google Scholar
Liu, C.Y., Chen, C., Mal, A.K., and Tu, K.N.: Direct correlation between mechanical failure and metallurgical reaction in flip chip solder joints. J. Appl. Phys. 85, 3882 (1999).Google Scholar
Kim, P.G., Jang, J.W., Lee, T.Y., and Tu, K.N.: Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni/Ti thin films and Ni foils. J. Appl. Phys. 86, 6746 (1999).Google Scholar
Gain, A.K., Chan, Y.C., and Yung, K.C.: Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1 wt% nano-TiO2 composite solder on flexible ball grid array substrates. Microelectron. Reliab. 51, 975 (2011).Google Scholar
Yang, Y., Balaraju, J.N., Huang, Y.Z., Liu, H., and Chen, Z.: Interface reaction between an electroless Ni-co-P metallization and Sn-3.5Ag lead-free solder with improved joint reliability. Acta Mater. 71, 69 (2014).CrossRefGoogle Scholar
Yang, Y., Balaraju, J.N., Chong, S.C., Xu, H., Liu, C.Q., Silberschmidt, V.V., and Chen, C.: Significantly retarded interfacial reaction between an electroless Ni-W-P metallization and lead-free Sn-3.5Ag solder. J. Alloys Compd. 565, 11 (2013).Google Scholar
Shen, J. and Chan, Y.C.: Research advances in nano-composite solders. Microelectron. Reliab. 49, 223 (2009).Google Scholar
Zhao, R., Ma, L.M., Zuo, Y., Liu, S.H., and Guo, F.: Retarding electromigration in lead-free solder joints by alloying and composite approaches. J. Electron. Mater. 42, 280 (2013).Google Scholar
Hu, X., Chan, Y.C., Zhang, K.L., and Yung, K.C.: Effect of graphene doping on microstructural and mechanical properties of Sn–8Zn–3Bi solder joints together with electromigration analysis. J. Alloys Compd. 580, 162 (2013).Google Scholar
Liu, C.Y., Tu, K.N., Sheng, T.T., Tung, C.H., Frear, D.R., and Elenius, P.: Electron microscopy study of interfacial reaction between eutectic SnPb and Cu/Ni(V)/Al thin film metallization. J. Appl. Phys. 87, 750 (2000).Google Scholar
Tseng, C.F. and Duh, J.G.: The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)6Sn5 compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction. J. Mater. Sci. 48, 857 (2013).Google Scholar
Gu, X., Chan, Y.C., Yang, D., and Wu, B.Y.: The shearing behavior and microstructure of Sn-4Ag-0.5Cu solder joints on a Ni-P-carbon nanotubes composite coating. J. Alloys Compd. 468, 553 (2009).Google Scholar
Gain, A.K., Fouzder, T., Chan, Y.C., and Yung, Y.C.: Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1 wt% nano-ZrO2 composite solder on OSP-Cu pads. J. Alloys Compd. 509, 3319 (2011).Google Scholar
Mallory, G.O. and Hajdu, J.B.: Electroless Plating: Fundamentals and Applications, 1st ed. (William Andrew, 1900).Google Scholar
Joint Committee on Powder Diffraction Standards Diffraction Data File, No. 37–1484 (International Centre for Diffraction Data (ICDD, formerly JCPDS), Newtown Square, PA, 2011).Google Scholar
Martorano, K.M., Martorano, M.A., and Brandi, S.D.: Optimal conditions for the wetting balance test. J. Mater. Process. Technol. 209, 3089 (2009).Google Scholar
Guo, J.J., Xian, A.P., and Shang, J.K.: Degradation of solderability of electroless nickel by phosphide particles. Surf. Coat. Technol. 202, 268 (2007).CrossRefGoogle Scholar
Chen, Z., He, M., and Qi, G.J.: Morphology and kinetic study of the interfacial reaction between the Sn-3.5Ag solder and electroless Ni-P metallization. J. Electron. Mater. 33, 1465 (2004).Google Scholar
Kim, H.K. and Tu, K.N.: Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening. Phys. Rev. B 53, 16027 (1996).CrossRefGoogle ScholarPubMed
Chada, S., Laub, W., Fournelle, R.A., and Guan, D.S.: An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates. J. Electron. Mater. 28, 1194 (1999).Google Scholar
Lu, Y.D., He, X.Q., En, Y.F., Wang, X., and Zhuang, Z.Q.: Polarity effect of electromigration on intermetallic compound formation in SnPb solder joints. Acta Mater. 57, 2560 (2009).Google Scholar
Hu, X., Xu, S., Yang, Y., Chen, Z., and Chan, Y.C.: Effect of TiO2 nanoparticle addition on electroless Ni – P under bump metallization for lead-free solder interconnection. Mater. Sci. Eng., A 600, 67 (2014).Google Scholar
Yoon, J.W. and Jung, S.B.: Growth kinetics of Ni3Sn4 and Ni3P layer between Sn–3.5Ag solder and electroless Ni–P substrate. J. Alloys. Compd. 105, 376 (2004).Google Scholar
Tu, P.L., Chan, Y.C., Hung, K.C., and Lai, J.K.L.: Growth kinetics of intermetallic compounds in chip scale package solder joints. Scr. Mater. 44, 317 (2001).Google Scholar
Sohn, Y.C., Yu, J., Kang, S.K., Shih, D.Y., and Lee, T.Y.: Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization. J. Mater. Res. 19, 2428 (2004).Google Scholar
Kim, S.W., Yoon, J.W., and Jeng, S.B.: Interfacial reactions and shear strengths between Sn-Ag-based Pb-free solder balls and Au/EN/Cu metallization. J. Electron. Mater. 33, 1182 (2004).CrossRefGoogle Scholar