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Reverse polarity effect from effective charge disparity during electromigration in eutectic Sn–Zn solder interconnect

Published online by Cambridge University Press:  31 January 2011

X.F. Zhang ,
J.D. Guo  and
J.K. Shang
X.F. Zhang
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People’s Republic of China
J.D. Guo
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People’s Republic of China
J.K. Shang*
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People’s Republic of China; and Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801
*
a)Address all correspondence to this author. e-mail: jkshang@uiuc.edu
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Abstract

Polarity effect on the interfacial reactions from high-density electric currents was investigated in a solder interconnect with a large disparity in the effective charge between the solder constituents. A reverse polarity effect was found where the intermetallic compound layer at the cathode grew significantly thicker than that at the anode under electric loading. Such an abnormal polarity effect was shown to result from electromigrations of Sn and Zn along opposite directions as dictated by the disparity in their effective charges. As Sn migrated to the anode under electron wind force, the resulting back stress drove Zn atoms to drift to the cathode. A kinetic analysis of the Zn mass transport explained the differential growth of the intermetallic compounds at the two electrodes, in good agreement with the experimental data.

Keywords

ElectromigrationSoldering
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 12: Biomimetic and Bio-enabled Materials Science and Engineering , December 2008 , pp. 3370 - 3378
Copyright
Copyright © Materials Research Society 2008

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References

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