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A sample preparation method for four point bend adhesion studies

Published online by Cambridge University Press:  03 March 2011

Zhenjiang Cui ,
Sure Ngo  and
Girish Dixit
Zhenjiang Cui*
Affiliation:
Applied Materials, Inc., Santa Clara, California 95054
Sure Ngo
Affiliation:
Applied Materials, Inc., Santa Clara, California 95054
Girish Dixit
Affiliation:
Applied Materials, Inc., Santa Clara, California 95054
*
a) Address all correspondence to this author. e-mail: david_cui@amat.com
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Abstract

A method to prepare samples for four point bend testing is reported in this paper. The traditional method of sample preparation involves time-consuming steps of sawing with a diamond saw followed by polishing with fine grit to remove the roughness of the sidewall. The new method uses cleaving along the 〈100〉 crystallographic direction, which renders smooth surfaces and eliminates the polishing steps. Load–displacement curves comparing polished versus cleaved samples show that the new technique provides improved results. Elimination of fracture-inducing defects is the primary benefit of this method, which also leads to data with tighter distributions.

Keywords

AdhesionSemiconductor
Type
Rapid Communications
Information
Journal of Materials Research , Volume 19 , Issue 5 , May 2004 , pp. 1324 - 1327
Copyright
Copyright © Materials Research Society 2004

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References

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