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Structure of composition-modulated Cu/Ni thin films prepared by electrodeposition

Published online by Cambridge University Press:  31 January 2011

J. Yahalom ,
D. F. Tessier ,
R. S. Timsit ,
A. M. Rosenfeld ,
D. F. Mitchell  and
P. T. Robinson
J. Yahalom
Affiliation:
Department of Materials Engineering, Technion-Israel Institute of Technology, Haifa, Israel
D. F. Tessier
Affiliation:
Alcan International Limited, Kingston Research and Development Centre, P.O. Box 8400, Kingston, Ontario, Canada K7L 5L9
R. S. Timsit
Affiliation:
Alcan International Limited, Kingston Research and Development Centre, P.O. Box 8400, Kingston, Ontario, Canada K7L 5L9
A. M. Rosenfeld
Affiliation:
Alcan International Limited, Kingston Research and Development Centre, P.O. Box 8400, Kingston, Ontario, Canada K7L 5L9
D. F. Mitchell
Affiliation:
Division of Chemistry, National Research Council of Canada, Ottawa, Ontario, Canada KIA OR9
P. T. Robinson
Affiliation:
Division of Chemistry, National Research Council of Canada, Ottawa, Ontario, Canada KIA OR9
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Abstract

Copper/nickel multilayered thin-films prepared by electrodeposition have been examined in cross section by electron energy loss spectroscopy and high-resolution transmission electron microscopy. The results of the examinations provide the first direct experimental evidence of the large composition modulation across successive layers in the thin-film structure and the coherent nature of Cu/Ni interfaces.

Type
Rapid Communications
Information
Journal of Materials Research , Volume 4 , Issue 4 , August 1989 , pp. 755 - 758
Copyright
Copyright © Materials Research Society 1989

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References

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