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Thin-film interactions and their relevance to electronic packaging

Published online by Cambridge University Press:  31 January 2011

Chin-An Chang
Chin-An Chang
Affiliation:
IBM T. J. Watson Research Center, Yorktown Heights, New York 10598
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Abstract

Thin-film interactions have been increasingly important to various aspects of electronic technologies, including devices and packaging. Extensive outdiffusion and alloy formation, for example, can be detrimental to the yield and reliability of the parts fabricated. Understanding such interactions, and their dependence on various factors, continues to be a challenge to thin-film scientists. Several aspects related to thin-film interactions are described in this paper: a review of the ambient effects that provides an understanding of the basic reaction mechanisms at the interface; an illustration of concerns upon choosing a diffusion barrier layer, and reaction across such a layer; and the effect of undesired outdiffusion on the solder spread related to joining.

Type
Articles
Information
Journal of Materials Research , Volume 2 , Issue 5 , October 1987 , pp. 697 - 703
Copyright
Copyright © Materials Research Society 1987

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References

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