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Time-dependent deformation behavior of freestanding and SiNx-supported gold thin films investigated by bulge tests

Published online by Cambridge University Press:  13 July 2015

Benoit Merle ,
Detlev Cassel  and
Mathias Göken
Benoit Merle*
Affiliation:
Materials Science & Engineering, Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Institute I, D-91058 Erlangen, Germany
Detlev Cassel
Affiliation:
Hochschule Kaiserslautern, Standort Zweibrücken, D-66482 Zweibrücken, Germany
Mathias Göken
Affiliation:
Materials Science & Engineering, Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Institute I, D-91058 Erlangen, Germany
*
a)Address all correspondence to this author. e-mail: benoit.merle@fau.de
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Abstract

A novel strain-rate jump method was developed for the plane-strain bulge test and used to investigate the time-dependent deformation behavior of gold thin films in the thickness range 100–400 nm. The experimental method is based on an abrupt variation of the pressurization rate. The evaluated strain-rate sensitivity was found to be five times higher for films in freestanding condition (m = 0.094) than for films tested on a SiNx substrate (m = 0.020). Bulge creep tests confirmed this increased time-dependence. The observation of the surface of the freestanding films after the creep tests provided evidence of apparent grain boundary sliding taking place next to intragranular plastic deformation. The out-of-plane deformation was presumably favored by the columnar microstructure of the samples, with grains extending between both free surfaces. In the case of SiNx-supported films, grain boundary sliding was prevented by the good adhesion of gold to the SiNx substrate.

Keywords

bulge testthin filmstrain-rate sensitivitycreeptime-dependencegold
Type
Articles
Information
Journal of Materials Research , Volume 30 , Issue 14 , 28 July 2015 , pp. 2161 - 2169
Copyright
Copyright © Materials Research Society 2015 

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References

REFERENCES

Meyers, M.A., Mishra, A., and Benson, D.J.: Mechanical properties of nanocrystalline materials. Prog. Mater. Sci. 51(4), 427–556 (2006).CrossRefGoogle Scholar
Dao, M., Lu, L., Shen, Y.F., and Suresh, S.: Strength, strain-rate sensitivity and ductility of copper with nanoscale twins. Acta Mater. 54(20), 5421–5432 (2006).Google Scholar
Schwaiger, R., Moser, B., Dao, M., Chollacoop, N., and Suresh, S.: Some critical experiments on the strain-rate sensitivity of nanocrystalline nickel. Acta Mater. 51(17), 5159–5172 (2003).Google Scholar
May, J., Höppel, H.W., and Göken, M.: Strain rate sensitivity of ultrafine-grained aluminium processed by severe plastic deformation. Scr. Mater. 53(2), 189–194 (2005).Google Scholar
Gianola, D.S., Warner, D.H., Molinari, J.F., and Hemker, K.J.: Increased strain rate sensitivity due to stress-coupled grain growth in nanocrystalline al. Scr. Mater. 55(7), 649–652 (2006).Google Scholar
Alaca, B.E., Toga, K.B., Akar, O., and Akin, T.: Strain-controlled bulge test. J. Mater. Res. 23(12), 3295–3302 (2008).Google Scholar
Emery, R.D. and Povirk, G.L.: Tensile behavior of free-standing gold films. Part I. coarse-grained films. Acta Mater. 51(7), 2067–2078 (2003).CrossRefGoogle Scholar
Emery, R.D. and Povirk, G.L.: Tensile behavior of free-standing gold films. Part II. fine-grained films. Acta Mater. 51(7), 2079–2087 (2003).Google Scholar
Jonnalagadda, K., Karanjgaokar, N., Chasiotis, I., Chee, J., and Peroulis, D.: Strain rate sensitivity of nanocrystalline au films at room temperature. Acta Mater. 58(14), 4674–4684 (2010).Google Scholar
Karanjgaokar, N., Chasiotis, I., Peroulis, D., and Jonnalagadda, K.: Strain rate and creep response of Au and Ni thin films. In Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics, 4, 2009. (Society for Experimental Mechanics, Bethel, CT, 2009); pp. 2373–2381.Google Scholar
Wang, L. and Prorok, B.C.: Strain rate dependent behavior of nanocrystalline gold films. In 11th International Congress and Exhibition on Experimental and Applied Mechanics, 4, 2008. (Society for Experimental Mechanics, Bethel, CT, 2008); pp. 1854–1859.Google Scholar
Solonovich, I.I.: Creep mechanisms of condensed polycrystalline films of copper in the range 20-150 degree C. Phys. Met. Metallogr. 40(3), 158–163 (1975).Google Scholar
Maier, V., Durst, K., Mueller, J., Backes, B., Höppel, H.W., and Göken, M.: Nanoindentation strain-rate jump tests for determining the local strain-rate sensitivity in nanocrystalline Ni and ultrafine-grained Al. J. Mater. Res. 26(11), 1421–1430 (2011).Google Scholar
Weertman, J.: Creep of polycrystalline aluminium as determined from strain rate tests. J. Mech. Phys. Solids 4(4), 230–234 (1956).CrossRefGoogle Scholar
Cieslar, M., Karimi, A., and Martin, J-L.: Plastic instabilities during biaxial testing of Al-Fe-Si foils. Mater. Sci. Forum 396–402(2), 1079–1084 (2002).Google Scholar
Merle, B. and Göken, M.: Fracture toughness of silicon nitride thin films of different thicknesses as measured by bulge tests. Acta Mater. 59(4), 1772–1779 (2011).Google Scholar
Schweitzer, E.W. and Göken, M.: In situ bulge testing in an atomic force microscope: Microdeformation experiments of thin film membranes. J. Mater. Res. 22(10), 2902–2911 (2007).Google Scholar
Merle, B. and Göken, M.: Bulge fatigue testing of freestanding and supported gold films. J. Mater. Res. 29(2), 267–276 (2014).Google Scholar
Vlassak, J.J. and Nix, W.D.: New bulge test technique for the determination of Young’s modulus and Poisson’s ratio of thin films. J. Mater. Res. 7(12), 3242–3249 (1992).Google Scholar
Xiang, Y., Chen, X., and Vlassak, J.J.: Plane-strain bulge test for thin films. J. Mater. Res. 20(9), 2360–2370 (2005).Google Scholar
Merle, B., Schweitzer, E.W., and Göken, M.: Thickness and grain size dependence of the strength of copper thin films as investigated with bulge tests and nanoindentations. Philos. Mag. 92(25–27), 3172–3187 (2012).Google Scholar
Cottrell, A.H.: Logarithmic and Andrade creep. Philos. Mag. Lett. 75(5), 301–307 (1997).Google Scholar
Nabarro, F.R.N.: Theory of Crystal Dislocations (Dover publications, Mineola, NY, USA, 1987).Google Scholar
Freund, L.B.: Stability of a dislocation threading a strained layer on a substrate. J. Appl. Mech. 54(3), 553–557 (1987).Google Scholar
Nix, W.D.: Mechanical properties of thin films. Metall. Trans. A 20(11), 2217–2245 (1989).Google Scholar
Xiang, Y. and Vlassak, J.J.: Bauschinger effect in thin metal films. Scr. Mater. 53(2), 177–182 (2005).Google Scholar
Göken, M., Höppel, H.W., Hausöl, T., Bach, J., Maier, V., Schmidt, C.W., and Amberger, D.: Grain refinement and deformation mechanisms in heterogeneous ultrafine-grained materials processed by accumulative roll bonding. In Proceedings of 33rd Risø Symposium on Materials Science: Nanometals—Status and Perspective, 2012. (Technical University of Denmark, Roskilde, Denmark, 2012); pp. 31–48.Google Scholar
Wei, Q., Cheng, S., Ramesh, K.T., and Ma, E.: Effect of nanocrystalline and ultrafine grain sizes on the strain rate sensitivity and activation volume: Fcc versus bcc metals. Mater. Sci. Eng., A 381(1–2), 71–79 (2004).Google Scholar
Frost, H.J. and Ashby, M.F.: Deformation-Mechanism Maps (Pergamon Press, Oxford, UK, 1982).Google Scholar
Meyers, M.A. and Chawla, K.K.: Mechanical Behavior of Materials (Cambridge University Press, Cambridge, UK, 2009).Google Scholar
Lüthy, H., White, R.A., and Sherby, O.D.: Grain boundary sliding and deformation mechanism maps. Mater. Sci. Eng. 39(2), 211–216 (1979).Google Scholar
Van Swygenhoven, H. and Derlet, P.M.: Grain-boundary sliding in nanocrystalline fcc metals. Phys. Rev. B: Condens. Matter Mater. Phys. 64(22), 2241051–2241059 (2001).Google Scholar
Maier, V., Merle, B., Göken, M., and Durst, K.: An improved long-term nanoindentation creep testing approach for studying the local deformation processes in nanocrystalline metals at room and elevated temperatures. J. Mater. Res. 28(9), 1177–1188 (2013).Google Scholar
Hosford, W.F.: Mechanical Behavior of Materials (Cambridge University Press, Cambridge, UK, 2005).Google Scholar