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Characterization of AlN-based Ceramic Composites for Use as Millimeter Wave Susceptor Materials at High Temperature: High Temperature Thermal Properties of AlN:Mo with 0.25% to 4.0% Mo by Volume

Published online by Cambridge University Press:  07 March 2019

Brad W. Hoff*
Affiliation:
Air Force Research Laboratory, Kirtland AFB, NM, 87117, USA
Frederick W. Dynys
Affiliation:
NASA Glenn Research Center, Cleveland, Ohio44135, USA
Steven C. Hayden
Affiliation:
Aramco Research Center – Boston, Aramco Services Company, Cambridge, MA02139, USA
Rachael O. Grudt
Affiliation:
Aramco Research Center – Boston, Aramco Services Company, Cambridge, MA02139, USA
Martin S. Hilario
Affiliation:
Air Force Research Laboratory, Kirtland AFB, NM, 87117, USA
Anthony E. Baros
Affiliation:
Air Force Research Laboratory, Kirtland AFB, NM, 87117, USA
Michele L. Ostraat
Affiliation:
Aramco Research Center – Boston, Aramco Services Company, Cambridge, MA02139, USA
*

Abstract

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In order to begin to evaluate and model the suitability of high temperature ceramic composites, such as AlN:Mo, as susceptor materials for power beaming applications, the electromagnetic, thermal, and mechanical properties of the material must be known at elevated temperatures. Work reported here focuses on the development of thermal property datasets for AlN:Mo composites ranging from 0.25% to 4.0% Mo by volume. To calculate thermal conductivity of the AlN:Mo composite series, specific heat capacity, thermal diffusivity, and density data were acquired. The calculated specific heat capacity, Cp, of the set of AlN:Mo composites was, on average, found to be approximately 803 J/kgK at 100 °C and to increase to approximately 1133 J/kgK at 1000 °C, with all values to be within +/- 32 J/kgK of the average at a given temperature. These calculated specific heat capacity values matched values derived from DSC measurements to within the expected error of the measurements. Measured thermal diffusivity, α, of the set of AlN:Mo composites was, on average, found to be approximately 3.93 x 10-1 cm2/s at 100 °C and to increase to approximately 9.80 x 10-2 cm2/s at 1000 °C, with all values within +/- 1.84 x 10-2 cm2/s of the average at a given temperature. Thermal conductivity, k, for the set of AlN:Mo composites was found to be approximately 108 W/mK at 100 °C and to decrease to approximately 38 W/mK at 1000 °C, with all values within +/- 5.3 W/mK of the average at a given temperature. Data trends show that increasing Mo content correlates to lower values of of Cp, α, and k at a given temperature.

Type
Articles
Creative Commons
Creative Common License - CCCreative Common License - BY
This is an Open Access article, distributed under the terms of the Creative Commons Attribution licence (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted re-use, distribution, and reproduction in any medium, provided the original work is properly cited.
Copyright
Copyright © Materials Research Society 2019

References

REFERENCES

Hoff, B.W., Hilario, M.S., Jawdat, B., Baros, A.E., Dynys, F.W., Mackey, J.A., Yakovlev, V. V., Andraka, C.E., Armijo, K.M., Savrun, E., and Rittersdorf, I.M., in 2018 Proc. IMPI’s 52nd Annu. Microw. Power Symp. (International Microwave Power Institute, Long Beach, CA, 2018), pp. 8283.Google Scholar
Hoff, B.W., Hilario, M., Jawdat, B., Agrawal, D., Lanagan, M., Cheng, J., and Dynys, F., in Proc. 12th Pacific Rim Conf. Ceram. Glas. Technol. (The Americal Ceramic Society, Waikoloa, HI, 2017), p. 61.Google Scholar
Hilario, M.S., Hoff, B.W., Young, M.P., and Lanagan, M.T., in 53rd AIAA Aerosp. Sci. Meet. (AIAA SciTech Forum, Kissimmee, FL, 2015), pp. 110.Google Scholar
Gaone, J.M., Tilley, B.S., and Yakovlev, V. V., in 2017 IEEE MTT-S Int. Microw. Symp. (IEEE, 2017), pp. 459462.Google Scholar
Yakovlev, V. V., Allan, S.M., Fall, M.L., and Shulman, H.S., in Microw. RF Power Appl., edited by Tao, J. (Cépaduès Éditions, Toulouse, 2011), pp. 303306.Google Scholar
“Sienna Technologies, Inc.” [Online]. Available: http://siennatech.com/. [Accessed: 06-Nov-2018].Google Scholar
Cooper, J.H., Process-Dependence of Properties in High Thermal Conductivity Aluminum Nitride Substrates for Electronic Packaging, Naval Postgraduate School, 1991.Google Scholar
Prohaska, G.W. and Miller, G.R., MRS Proc. 167, 215 (1989).CrossRefGoogle Scholar
Jackson, T.B., Virkar, A. V., More, K.L., Dinwiddie, R.B., and Cutler, R.A., J. Am. Ceram. Soc. 80, 1421 (2005).CrossRefGoogle Scholar
Kurokawa, Y., Utsumi, K., and Takamizawa, H., J. Am. Ceram. Soc. 71, 588 (1988).CrossRefGoogle Scholar
Khan, A.A. and Labbe, J.C., J. Eur. Ceram. Soc. 17, 1885 (1997).CrossRefGoogle Scholar
Khan, A.A. and Labbe, J.C., Mater. Sci. Eng. A 230, 33 (1997).CrossRefGoogle Scholar
Khan, A.A. and Labbe, J.C., J. Eur. Ceram. Soc. 16, 739 (1996).CrossRefGoogle Scholar
Chase, M.W., J. Phys. Chem. Ref. Data, Monogr. 9, 1 (1998).Google Scholar
Liu, Y., Jiang, Y., Zhou, R., Liu, X., and Feng, J., Ceram. Int. 41, 5239 (2015).CrossRefGoogle Scholar
Hurst, J.E. and Harrison, B.K., Chem. Eng. Commun. 112, 21 (1992).CrossRefGoogle Scholar
Gabbott, P., in edited by Gabbott, P. (Blackwell Publishing Ltd., Oxford, UK, (2008), pp. 150.Google Scholar
Parker, W.J., Jenkins, R.J., Butler, C.P., and Abbott, G.L., J. Appl. Phys. 32, 1679 (1961).CrossRefGoogle Scholar
Vozár, L. and Hohenauer, W., High Temp. - High Press. 35–36, 253 (2003).CrossRefGoogle Scholar
Clark, L.M. and Taylor, R.E., J. Appl. Phys. 46, 714 (1975).CrossRefGoogle Scholar
ASTM International, ASTM E1461−13 Standard Test Method for Thermal Diffusivity by the Flash Method (West Conshohocken, PA, 2016).Google Scholar
Ho, C.Y., Powell, R.W., and Liley, P.E., Thermal Conductivity of Selected Materials Part 2 (National Standard Reference Data Series 16, National Bureau of Standards, Washington, D.C., 1968).Google Scholar
Hasselman, D.P.H. and Johnson, L.F., J. Compos. Mater. 21, 508 (1987).CrossRefGoogle Scholar
Maxwell, J.C., A Treatise on Electricity and Magnetism, Vol. I, 3rd ed. (Oxford University Press, Oxford, UK, 1904).Google Scholar
Chhillar, P., Agrawal, D., and Adair, J.H., Powder Metall. 51, 182 (2008).CrossRefGoogle Scholar
Kim, B.-S., Kim, E., Jeon, H.-S., Lee, H.-I., and Lee, J.-C., Mater. Trans. 49, 2147 (2008).CrossRefGoogle Scholar