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Accuracy of the Fatigue Lifetime of Polysilicon Predicted from its Strength Distribution

Published online by Cambridge University Press:  01 February 2011

Le Huy Vu
Affiliation:
chw86502@stn.nitech.ac.jp, Nagoya Institute of Technology, Nagoya, Japan
Joao Gaspar
Affiliation:
gaspar@imtek.de, University of Freiburg, Freiburg, Germany
Oliver Paul
Affiliation:
paul@imtek.de, University of Freiburg Freiburg, Freiburg, Germany
Shoji Kamiya
Affiliation:
kamiya.shoji@nitech.ac.jp, Nagoya Institute of Technology, Nagoya, Japan
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Abstract

This paper discusses the accuracy of the distribution of the fatigue lifetime of polysilicon thin films predicted from their strength distribution. On the basis of the authors' previous studies, where the fatigue process determining the lifetime was formulated using the well-known fatigue crack extension Paris' law, prediction error ranges for polysilicon specimens with different levels of strength are determined. The errors of the predicted fatigue lifetime in the logarithmic scale, defined as △logN = |log10Nexp-log10Npred| where Nexp and Npred were the experimental and predicted number of cycle, were found to be less than 1 in the range of the cumulative fracture probability F between 0.1 and 0.9. Therefore, based on the measured Paris' law parameters of polysilicon, the fatigue lifetimes of different polysilicon thin film structures can be predicted from their strength distributions with errors of roughly 10% in the logarithmic scale, which was average of percentages of △logN to log10N of experimental data.

Type
Research Article
Copyright
Copyright © Materials Research Society 2010

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References

1 Muhlstein, C. L., Brown, S. B., Ritchie, R. O., “High-Cycle Fatigue of single-crystal silicon thin films”, J. Microelectromech. Syst., vol. 10, pp. 593600, 2001.Google Scholar
2 Sharpe, W. N. Jr, Bagdahn, J., “Fatigue Testing of Polysilicon -a Review”, Mech. Mater., vol. 36, 311, 2004.Google Scholar
3 Tsuchiya, T., Tabata, O., Sakata, J., Taga, Y., “Specimen Size Effect on Tensile Strength of Surface Micromachined Polycrystalline Silicon Thin Films”, J. Microelectromech. Syst., vol. 7, pp. 106113, 1998.Google Scholar
4 Kubodera, Y., Izumi, S., Sakai, S., Miyajima, H., Murakami, K., Isokawa, T., “Influence of distribution of etching damage on brittle strength of single crystal silicon” (in Japanese), The Society of Material Science Japan, Material, vol. 59, No. 10, pp. 920925, 2007.Google Scholar
5 Kamiya, S., Amaki, S., Kawai, T., Honda, N., Ruther, P., Gaspar, J., Paul, O., “Seamless interpretation of the strength and fatigue lifetime of polycritalline silicon thin films”, J. Micromech. Micoeng., vol. 18, 095023, 2008.Google Scholar
6 Evans, A. G. and Fuller, E.R, “Crack propagation in ceramic Materials under cyclic loading conditions”, Metallurgical Transactions, vol.5, pp.2733, 1974.Google Scholar
7 Kawai, T., Amaki, S., Gaspar, J., Ruther, P., Paul, O., Kamiya, S., “Prediction of Fatigue Lifetime Based on Static Strength and Crack Extension Law”, in Tech. Digest MEMS 2008 Conference, pp. 431434, Tucson, January 13-17, 2008.Google Scholar
8 Kamiya, S., Kuypers, J., Trautmann, A., Ruther, P., Paul, O., “Process Temperature Dependent Mechanical Properties of Polysilicon Measured Using a Novel Tensile Test Structures”, J. Microelectromech. Syst., vol. 16, pp. 202212, 2007.Google Scholar
9 Weibull, W., “A statistical distribution function of wide applicabilityJ. Appl. Mech. 18 293–7, 1951.Google Scholar
10 Bagdahn, J., Sharpe, W. N. Jr , “Fatigue of polycrystalline silicon under long-term cyclic loading”, Sensors Actuators, vol. A 103, pp. 915, 2003.Google Scholar
11 Davidge, R.W., Mechanical Behavior of Ceramics, Camdridge University Press, 1979.Google Scholar