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Advanced Materials for Printed Circuit Boards

Published online by Cambridge University Press:  21 February 2011

David Wei Wang
David Wei Wang*
Affiliation:
IBM Corporation, Systems Technology Division, 1701 North Street, Endicott, New York 13760
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Extract

The printed circuit board is an integral part of the electronic packaging hierarchy. Its use began more than 40 years ago, and the demand for printed circuit boards has increased in parallel with the growth of the electronics industry.[1] According to a recent forecast, the worldwide production of printed circuit boards will reach to over 19 billion U.S. dollars' worth by 1990.[2] With continuing demands for more interconnections, the multilayer circuit board industry is experiencing its fastest growth rate. Boards with more than 20 inner planes of circuitry are being manufactured with high reliability.

Based on dollar values, more than 90% of the circuit boards produced are in the rigid board category, where starting materials are based on thermosetting prepregs produced by a solution impregnation method. This article is a review of materials currently used in rigid composites.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 108 , 1987 , 125
Copyright
Copyright © Materials Research Society 1988

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References

REFERENCES

1.Pole-Baker, M. E., Printed Circuit Fabr. 7(12), 26(1984); Printed Circuit Fabr., 8(1), 103(1985)Google Scholar
2.“PCB Information Service, Quarterly Report,” BPA (Technology and Management) Ltd., Dorking, U.K., November 1986Google Scholar
3.Seraphim, D. P., Barr, D. E., Chen, W. T., and Schmitt, G. S., Advanced Thermoset Composites, edited by Margolis, J. M., Van-Norstrand Reinhold, New York (1986), p.110Google Scholar
4.Seraphim, D. P., Lee, L. C., Appelt, B. K., and Marsh, L. L., Electronic Packaging Materials Science, edited by Giess, E. A., Tu, K. N., and Uhlmann, D. R. (Mater. Res. Soc. Symp. Proc. 40, 1985) pp. 21–47Google Scholar
5.Chellis, L. N., U.S. Pat. 3,523,037(1970)Google Scholar
6.McGowan, D. R., Printed Circuit Fabr. 7(8), 53–59(1984)Google Scholar
7.Saunders, T. F., Levy, M. F., and Serino, J. F., J. Polym. Sci., A–1, 5,1609(1967)Google Scholar
8.Zahir, S. A., Adv. Org. Coat. Sci. Ser. 4, 83–102(1982)Google Scholar
9.Jackson, R. J., Pigneri, A. M., and Galgoci, E. C., Electronic Materials and Processes, edited by Kordsmerier, N. H., Haper, C. A., and Lee, S. M. (Intl. SAMPE Electron. Conf. Ser., 1, 1987) pp. 204–212Google Scholar
10.LaLiberte, B. R., Sacher, R. E., and Bornstein, J., AMHRC-TR-81-30(1981)Google Scholar
11.Hagnauer, G. L. and Dunn, D. A., J. Appl. Polym. Sci. 26, 1837–1846(1981)Google Scholar
12.Numata, S., Fujisaki, K., Makino, D., and Kinjo, N., Recent Advances in Polyimides Science and Technology, edited by Weber, W. D. and Gupta, M. R., Mid-Hudson Section Soc. of Plat. Eng. Inc.(1987) pp.164–173Google Scholar
13.Scola, D. A., Intl. SAHPE Symp. Exhib. [Proc] 31, 1844–55(1986)Google Scholar
14.Hergenroter, P. M., J. Macrmol. Sci. Rev. Macromol. Chem. C19(1) 1–34(1980); A. L. Landis and A. B. Naselow, Polyimides, Synthesis, Characterization, and Applications, edited by K. L. Mittal, Plenum Press, N.Y. vol.1(1984), p. 39Google Scholar
15.Goldberg, E. J., U.S. Pat. 2,958,672(1960); M. Gurffax, and J. L. Locatelli, J. Macrmol. Sci. Rev. Macromol. Chem. 4,111,919(1978) 138Google Scholar
16.D'Alelio, G. F., U.S. Pat. 3,890,272(1975)Google Scholar
17.Zahir, S. A. and Renser, A., U.S. Pat. 4,100,140(1978)Google Scholar
18.Harris, F. W. and Stille, J. K., Macromol. 1, 463(1968)Google Scholar
19.Crivello, J. V., J. Polym. Sci. Polym Chem. Ed., 1185–1200(1973)Google Scholar
20.Graham, W. F., U. S. Pat. 4,288,359(1981)Google Scholar
21.Pignerl, A. M., Galgoci, E. C., Jackson, R. J., and Young, G. C., Proc. of Tech. Program, Natl. Electron. Packag. and Prod. Conf. West '87, Anaheim, Calif. 1987, pp.29–45, Macromol. 1, 463 (1968), in Electronic Materials and Processes edited by N. H. Kordsmerier, C. A. Haper, and S. M. Lee (Internatl. SAMPE Electron. Conf. Ser., 1, 1987) pp. 657–667Google Scholar
22.Bargain, M., Combet, A., and GrosJean, P., U.S.Pat. 3,562,223(1971); M. Bargain and P. Gorsjean, Macromol. 1, 3,526,764(1971)Google Scholar
23.Bednar, P., IPC Technical Paper, TP-048(1975); J. W. Lamp and D. L. Boaz, AFML-TR-77-210, vol. 1 and 2 (1977)Google Scholar
24.Stenzenberger, H. D., U.S.Pats 4,211,800(1980), 4,303,799(1981)Google Scholar
25.Takahashi, A., Yokosawa, S., Wajima, M., and Tsukanishi, K., IPC Technical Paper, WCIII-14, (1984)Google Scholar
26.Stenzenberger, H. D., Herzog, M., Romer, W., Pierce, S., Canning, M. S., IPC Technical Paper, TP-602(1986); Macromol., R. Sheiblich, and K. Fear, Natl. SAMPE Symp. Exhib. [Proc] 30, 1568–84(1985)Google Scholar
27.Storch, R. and Gerber, H., Angew. Chem. 72. 1000(1960)Google Scholar
28.Martin, D. and Bauer, M., Org. Synth. 61, 35–8(1983)Google Scholar
29.Weirauch, K. K., IPC Technical Paper, TP–066(1975)Google Scholar
30.Gaku, M., IPC Technical Paper, TP-283(1979); BT Resin-Glass Fabrics Multilayer Materials, Mitsubishi Gas Chemical Company, Inc.(1984)Google Scholar
31.Hudock, F. A. and Ising, S.J., IPC Technical Paper, TP–618(1986)Google Scholar
32.Jensen, K. A. and Holm, A., in Chemistry of Cyanates and Their Thio Derivatives, edited by Patai, S., vol.1, J. Wiley, New York(1977) pp.569–618Google Scholar
33.Shimp, D. A., Intl. SAMPE Symp. Exhib. [Proc.] 32,1063–1072 (1987); M. Bauer, J. Bauer, and G. Kuhn, Acta Polym. 37, 715–719(1987)Google Scholar
34.Sergecv, V. A., Shitikov, V. K., and Pankratov, V. A., Russ. Chem. Rev. 48(1), 79–93(1979)Google Scholar
35.Prevorsek, D. C. and Chung, D. C., U.S.Pat. 4,157,360(1979); D. H. Wertz and D. C. Prevorsek, Polym. Eng. and Sci., 25, 804(1985)Google Scholar
36.Daley, L. R. and Christie, F. R., U.S. Pat. 4,456,712(1984)Google Scholar
37.Mitchell, J. P. and Welsher, T. L., IPC Technical Paper, WC2–2A5(1981)Google Scholar
38.Brody, M., Printed Circuit Fabr. 8(12), 22(1985)Google Scholar
39.Mohr, J. G., in Handbook of Fillers and Reinforcements for Plastics, edited by Katz, H. S. and Milewski, J. V., Van Norstrand, N.Y.(1978) pp.467–503Google Scholar
40.Plueddemann, E. P., Silane Coupling Agents, Plenum Press, New York (1982)Google Scholar
41.Keeler, R., Electron. Packag. & Prod., 26(1), 141(1986); J. Balde and G. Messner, Circuit World, 14(1), 11(1987)Google Scholar
42.Arthur, D. L., IPC Technical Paper, TP-585(1986); Electron. Packag. & Prod., 26(1), 141. C. S. Jackson “Fluoropolymer Composite PWB for High Speed Digital Applications,” presented at Intl. Electron. Packag. Soc. Symp, Orlando, Fl. October 1985.Google Scholar
43.Haper, C. A. and Staley, W. W., Electron. Packag. & Prod. 25(11), 52(1985)Google Scholar
44.Gaku, M., Ikeguchi, N., and Ayano, S., Electron. Packag. & Prod. 25(12), 30(1985)Google Scholar
45.Johnson, D. D., U.S. Pat. 4,680,220(1987); Electron. Packag. & Prod., 26(1), 141 (1986). Electron. Packag. & Prod. 27(2), 80(1987)Google Scholar
46.Johnson, J., Printed Circuit Fabr. 9(6), 56(1986)Google Scholar
47.Beuhler, A. J. and Wrezel, J. A., U.S.Pat. 4,604,438(1986)Google Scholar
48.Beuhler, A. J., Wrezel, J. A., Maas, J. L., and Sundahl, R. C. Jr, Electronic Packagin; Materials Science, edited by Jackson, K. A., Pohanka, R. C., Uhlmann, D. R., and Ulrich, D. R. (Mater. Res. Soc. Symp. Proc. 72, 1986) pp. 223–229Google Scholar
49.Sawatari, N., Natanabe, I., Okuyama, H., and Murakawa, K., IEEE Trans. on Electrical Insulation. EI–18, No.2, 131(1983)Google Scholar
50.M. Saito and Oodaira, Europ. Pat. 0194655(1986) 860917Google Scholar
51.Gaku, M., Kimbrara, H., Muramoto, H., Higashida, S., and Sato, F., WO 8606085(1986); E. P. Loo and D. J. Murry, Europ. Pat. Appl. EP 014,754,882(1985)Google Scholar
52.Jensen, W. M., U.S. Pat. 4,318,954(1982); A. W. Noblett, et. al. IPC Technical Paper, TP-648(1987)Google Scholar
53.Leibowitz, J. D., U.S.Pats 4591659(1986); 4,689,110(1987)Google Scholar
54.Leibowtiz, J. D., Winter, W., and Kolkin, J., Electron. Packag. Prod. 25(6), 86(1985)Google Scholar
55.Thaw, C., Minet, R., Zemany, J., and Zweben, C., SAMPE J. 23(6),40–43(1987)Google Scholar
56.Hayes, L., Printed Circuit Fabr., 7(12), 49(1984)Google Scholar
57.Reimann, W. G. and Gates, L. E., IPC Technical Paper, TP–443 (1982)Google Scholar
58.Mahler, B., IPC Technical Paper, TP–441 (1982)Google Scholar
59.Hoda, S. N., Printed Circuit Fabr.,9(11), 109–112(1986)Google Scholar
60.Gasparaitis, D. D., Lauroesch, M. W., Proc. of Tech. Conf., Sixth Annual Intl. Electron. Packag. Conf. San Diego, CA. 1986, p. 27–39Google Scholar
61.Brooks, C. T., Printed Circuit Fabr. 5(2), 32(1982)Google Scholar
62.Mogle, R. A. and Sober, D. J., IPC Technical Paper, TP–475 (1983)Google Scholar
63.Lindblom, S. H., IPC Technical Paper, TP–617(1986); F. Gray et. al., IPC Technical Paper, TP-547(1985)Google Scholar
64.Hanson, J. R. and Hauser, J. L., Electron. Packag. Prod., 26(11), 48(1986)Google Scholar
65.Gray, F., Cartwright, L., and Lindblom, S., Printed Circuit Fabr., 9(2), 48(1986)Google Scholar
66.Timpane, E.F., IPC Technical Paper, TP–529(1985)Google Scholar
67.Quinn, K., Travis, J., and Ganjie, J., 19th Annl. Connectors and Interconnection Tech. Symp. Proc. 1986, pp. 35–45; IPC Technical Paper, TP-529(1985), in Electronic Materials and Processes edited by N. H. Kordsmerier C. A. Haper, and S. M. Lee (Intl. SAMPE Electron. Conf. Ser., 1, 1987) pp. 668–680Google Scholar
68.Travis, J. and Ganjei, J., Printed. Circuit. Fabr. 9(7), 89(1986)Google Scholar
69.Jacobi, W. and Krisch, M, Printed. Circuit. Fabr. 50(1986)Google Scholar
70.Ganjie, J. and Frisch, D. C., Circuit Manufacturing, 26(6), 39(1986)Google Scholar