Hostname: page-component-78c5997874-4rdpn Total loading time: 0 Render date: 2024-11-18T03:18:29.574Z Has data issue: false hasContentIssue false
  • English
  • Français

Atomic-modeling and Simulation of Copper Sulfide as Micro Solid Lubricant

Published online by Cambridge University Press:  01 May 2013

Tomohiro Sato ,
Yoshimasa Hirai ,
Takehisa Fukui ,
Takahiro Ejima ,
Masanori Takuma  and
Ken-ichi Saitoh
Tomohiro Sato
Affiliation:
Technology Development Division, Kurimoto, LTD, 2-8-45 Shibatani Suminoe-ku, Osaka-shi, Osaka 5590021, Japan
Yoshimasa Hirai
Affiliation:
Technology Development Division, Kurimoto, LTD, 2-8-45 Shibatani Suminoe-ku, Osaka-shi, Osaka 5590021, Japan
Takehisa Fukui
Affiliation:
Technology Development Division, Kurimoto, LTD, 2-8-45 Shibatani Suminoe-ku, Osaka-shi, Osaka 5590021, Japan
Takahiro Ejima
Affiliation:
Graduate School of Science and Engineering, Kansai University, Suita-shi, Osaka 5648680, Japan
Masanori Takuma
Affiliation:
Department of Mechanical Engineering, Kansai University, Suita-shi, Osaka 5648680, Japan
Ken-ichi Saitoh
Affiliation:
Department of Mechanical Engineering, Kansai University, Suita-shi, Osaka 5648680, Japan
Get access

Abstract

Many industries have developed new materials as substitutes for lead in solid lubricants. For example, lead bronze, a Cu-Pb alloy that has been used for slide bearings, has been replaced by a Cu alloy containing sulfide. The development of Pb-free Cu alloys has received considerable attention recently. Pb and sulfide are types of solid lubricants; in particular, MoS2 (molybdenum disulfide) is a popular sulfide lubricant. This study focuses on a material that contains Cu2S. The properties of Cu2S as a solid lubricant are unknown. First principles (FP) and molecular dynamics (MD) are used to clarify the lubrication mechanism of Cu2S. The atomiclevel stable structure of Cu2S is evaluated by FP under specific sliding conditions. The Cu2S lubrication mechanism is clarified by MD using the FP results for the interatomic potential functions. It is clarified that there is a specific slip system and the Cu-S bonds that exists above and below the layers of the slip system are very strong.

Keywords

Ssimulationmicrostructure
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1513: Symposium GG – Mechanical Behavior of Metallic Nanostructured Materials , 2013 , mrsf12-1513-gg10-09
Copyright
Copyright © Materials Research Society 2013

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Sato, T., Hirai, Y., Maruyama, T., and Kobayashi, T., Procedings of Powder Metallurgy World Congress and Exhibition 2010, 2, 313–319(2010).Google Scholar
Tanizawa, K., Usami, H., Sato, T., Hirai, Y., and Fukui, T., Key Engineering Materials. 523–524 805–808(2012).10.4028/www.scientific.net/KEM.523-524.805CrossRefGoogle Scholar
Onodera, T., Morita, Y., Suzuki, A., Koyama, M., Tsuboi, H., Hatakeyama, N., Endou, A., Takabe, H., Kubo, M., Dassenoy, F., Minfray, C., Joly-Pottuz, L., Martin, J.M., and Miyamoto, A., J. Phys. Chem., B,113, 16526–16536(2009).10.1021/jp9069866CrossRefGoogle Scholar