Hostname: page-component-78c5997874-s2hrs Total loading time: 0 Render date: 2024-11-17T21:14:26.550Z Has data issue: false hasContentIssue false
  • English
  • Français

Basic: Bio-Inspired Assembly of Semiconductor Integrated Circuits•

Published online by Cambridge University Press:  17 March 2011

R. Bashir ,
S. Lee ,
D. Guo ,
M. Pingle ,
D. Bergstrom ,
H. A. Mcnally  and
D. Janes
R. Bashir
Affiliation:
School of Electrical and Computer Engineering Department of Biomedical Engineering, bashir@ecn.purdue.edu
S. Lee
Affiliation:
School of Electrical and Computer Engineering
D. Guo
Affiliation:
School of Electrical and Computer Engineering
M. Pingle
Affiliation:
Dept. of Medicinal Chemistry, Purdue University, W. Lafayette, IN. 47906
D. Bergstrom
Affiliation:
Dept. of Medicinal Chemistry, Purdue University, W. Lafayette, IN. 47906
H. A. Mcnally
Affiliation:
School of Electrical and Computer Engineering
D. Janes
Affiliation:
School of Electrical and Computer Engineering
Get access

Abstract

In the recent years, biologically-inspired self-assembly of artificial structures, some with useful optical properties, has been demonstrated. However, to date there has been no demonstration of self-assembly of useful electronic devices for the construction of complex systems. In this paper, a new process called BASIC (Bio-Inspired Assembly of Semiconductor Integrated Circuits) is proposed. The main theme is to use the mutual binding (hybridization) and specificity of DNA strands (oligonucleotides) for the assembly of useful silicon devices on silicon or other substrate. These devices need to be ‘released’ from their host substrate into a liquid medium where they can be functionalized with single stranded DNA. Silicon-on-insulator (SOI) substrates, which naturally lend themselves for such application, due to the presence of an oxide layer underlying the silicon layer, are used. These devices can vary in size and have a thin gold layer on one surface. This approach can be used to assemble micro and nano-scale devices and circuits and can also be a powerful technique for heterogeneous integration of materials (e.g. Si on Glass or polymer). The general idea of the BASIC process can also be extended to be used with any antibody/antigen complex. Preliminary results regarding the fabrication and release of the device islands will be presented. In addition, surface AFM characterization of the gold surfaces, prior to attachment of bio-molecules, is also presented.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 636: Symposium D – Nonlithographic and Lithographic Methods of Nanofabrication-From Ultralarge Scale , 2000 , D11.7.1
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Footnotes

•

Work supported by National Science Foundation and the State of Indiana Research and Technology Fund

References

1. Chen, J., Reed, M. A., A. M. Rawlett and Tour, J. M., Science, 286, 1550, 19 Nov 1999 Google Scholar
2. Kasibhatla, B., Labonte, A.P., Datta, S., Reifenberger, R. and Kubiak, C. P., Science, in publication.Google Scholar
3. Madhukar, A., Xie, Q., Chen, P., and Konkar, A., Appl. Phys. Lett., 64, 20, 16th May, 2727 (1994).Google Scholar
4. Kamins, T. I., Carr, E. C., Williams, R. S., and Rosner, S. J., J. Appl. Phys., 81 (1), 1st January, 211 (1997).Google Scholar
5. Bashir, R., Kabir, A. E., and Chao, K., Applied Surface Science, 152, 99 (1999).Google Scholar
6. Balandin, A., Jin, G., and Wang, K. L., Journal of Electronic Materials, 29, (5), (2000), p. 549.Google Scholar
7. Seeman, N. C., Nanotechnology, 149, (1991).Google Scholar
8. Seeman, N. C., Annual Rev. Biophys. Biomol. Struc. Vol. 27, 225 (1998).Google Scholar
9. Mirkin, C. A., Letsinger, R. L. et al. , Nature, Vol. 382, 15th August, 607 (1996).Google Scholar
10. Alivisatos, A. P., Johnsson, K. P. et al. , Nature, Vol. 382, 15th August, 609 (1996).Google Scholar
11. Martin, B. R., Dermody, D. J. et al. , Adv. Mater. 11, No. 12, 1021 (1999).Google Scholar
12. Mayer, T. S., Jackson, T. N. et al. , 1999 Materials Research Society Fall Meeting Digest, 157 (1999).Google Scholar
13. Ackley, D. E. et al. , Proceedings - Lasers and Electro-Optics Society, Annual Meeting-LEOS, vol 1, 85 (1998).Google Scholar
14. Bashir, R., To Appear in December Issue of Superlattices and Microstructures (2000)Google Scholar
15. Edman, C. F., Swint, R. B. et al. , IEEE Photonics Technology Letters, Vol. 12, No. 9, September, 1198 (2000).Google Scholar