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Continuous Wetiability Measurement for Solder Reflow

Published online by Cambridge University Press:  26 February 2011

Cynthia M. Melton ,
Susan M. Yarling  and
Carl J. Raleigh
Cynthia M. Melton
Affiliation:
Motorola, Inc., 1301 E. Algonquin Rd., Schaumburg, II. 60196
Susan M. Yarling
Affiliation:
Motorola, Inc., 1301 E. Algonquin Rd., Schaumburg, II. 60196
Carl J. Raleigh
Affiliation:
Motorola, Inc., 1301 E. Algonquin Rd., Schaumburg, II. 60196
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Abstract

A quantitative dynamic solder wettability mesurement technique was utilized to evaluate the effects of reflow processing on the wettability parameters associated with solder ball alloys. This technique enables the examination of the final degree of solder wetting and the continuous monitoring of wetting as a function of time during the reflow process under nitrogen atmosphere. An experimental design approach employing a 24 full factorial experiment was formulated to illustrate the use of this measurement technique investigating the final result of wetting. Solder wettability was determined with respect to the contact angle, base diameter and height of the reflowed solder ball alloy. The most significant effect estimates with respect to contact angle were solder flux and pad metallization. Solder ball alloy was found to significantly impact the base diameter and height of the reflowed solder. The effect of solder flux activators and pad metallizations on the subsequent continuous solder wettability wetting rates and amount of molten solder spread of solder ball alloys during reflow were measured. Reflow with a relatively more activated solder flux material was found to enhance the rate of solder wetting of the the pad metallization.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 226: Symposium H – Mechanical Behavior of Materials and Structures in Microelectronics , 1991 , 29
Copyright
Copyright © Materials Research Society 1991

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References

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