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Control of Thin Film Materials Properties Used in High Density Multichip Interconnect

Published online by Cambridge University Press:  21 February 2011

J.J.H. Rechell
J.J.H. Rechell*
Affiliation:
Polycon, 2686-B Johnson Dr. Ventura, CA, 93003
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Abstract

Most literature on High Density Multichip Interconnect (HDMI) focuses almost exclusively on processing of the organic dielectric. Nevertheless, it is only one of the components in High Density Multichip Modules.

Substrate properties, metal dielectric adhesion, internal stresses in the various films, and many other physico-chemical properties of the materials, can all be affected by neighbouring layers or process parameters improperly identified. Thus, in the course of process development, the real causes of difficulties and observed phenomenas can easily be misconstrued.

This paper reviews some of the relationships between the properties of the thin film metallization and their effects on the dielectric layers. It also points out to some of the difficulties that can occur when treating the dielectric and the metallic layers as separate issues.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 154: Symposium K – Electronic Packaging Materials Science IV , 1989 , 39
Copyright
Copyright © Materials Research Society 1989

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