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Cracking in Thin Films and Substrates
Published online by Cambridge University Press: 22 February 2011
Abstract
A crack terminating perpendicularly at the bimaterial interface is analyzed. Stress distributions for a broad range of elastic moduli and yield strength mismatch are discussed. These results can be used to understand the effect of mechanical properties mismatch on the competition between crack deflecting into the interface and crack penetrating into the base material. The role of microdefects near the interface is explored.
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- Copyright © Materials Research Society 1992
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